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1مؤتمرStudy of Charge Neutralization Techniques to Prevent Copper Corrosion On Post-FIB Wet Stained Sample
المؤلفون: Lee, Sharon, Hong, Li Li, Ley Hong, Khoo, Chuan, Ang Poh, Zhi Qiang, Mo
المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-4 Jul, 2019
Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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المؤلفون: Sharon Lee, Zhiqiang Mo, Ley Hong Khoo, Lihong Li, Poh Chuan Ang
المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
مصطلحات موضوعية: Materials science, business.industry, Oxide, chemistry.chemical_element, Blanket, Focused ion beam, chemistry.chemical_compound, chemistry, Stack (abstract data type), Optoelectronics, Sample preparation, Wafer, business, Tin, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c3ff9e89e0641056b19a11afa362a6a
https://doi.org/10.1109/ipfa49335.2020.9260593 -
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المؤلفون: Sharon Lee, Ley Hong Khoo, Li Hong Li, Poh Chuan Ang, Zhi Qiang Mo
المصدر: Microelectronics Reliability. 109:113636
مصطلحات موضوعية: Materials science, Metallurgy, Copper interconnect, Silicon on insulator, chemistry.chemical_element, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics, Die (integrated circuit), Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Neutralization method, chemistry, Wafer, Electrical and Electronic Engineering, Erosion corrosion of copper water tubes, Safety, Risk, Reliability and Quality, Electrical conductor
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