يعرض 1 - 10 نتائج من 98 نتيجة بحث عن '"Li, Cai-Fu"', وقت الاستعلام: 0.83s تنقيح النتائج
  1. 1
    مؤتمر
    Effects of Sintering Parameters on Silver Joints Prepared with Micron Silver Paste for Power Electronics

    المؤلفون: Chen, Zehao, Huang, Shijun, Li, Cai-Fu

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    Micron-Scale Silver Flake Paste Sintering Without Pressure for Power Electronic Die Attachment

    المؤلفون: Huang, Shijun, Luo, Ruidong, Wu, Zhen, Li, Cai-Fu

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    دورية أكاديمية
    Low-temperature copper sinter-joining technology for power electronics packaging: A review

    المؤلفون: Wang, Yujian, Xu, Dou, Yan, Haidong, Li, Cai-Fu, Chen, Chuantong, Li, Wanli

    المصدر: In Journal of Materials Processing Tech. November 2024 332

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  4. 4
    مؤتمر
    Ag flakes based stretchable composite tracks with high conductivity by adding AgNWs

    المؤلفون: Li, Cai-Fu, Zhang, Hao, Liu, Zhi-quan, Suganuma, Katsuaki

    المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

    Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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  5. 5
    مؤتمر
    Highly Conductive Stretchable Wirings Composed of Ag Foils and Elastomer

    المؤلفون: Li, Cai-Fu, Zhang, Bowen, Suganuma, Katsuaki, Zhang, Hao, Sugahara, Tohru, Li, Wanli, Liu, Zhi-Quan

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1022-1025 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Enhanced high temperature stability of printed Cu wirings based on large Cu particle ink, Ag element addition, and intense pulsed light sintering

    المؤلفون: Li, Wanli, Li, Linying, Li, Cai-Fu, Jiu, Jinting, Suganuma, Katsuaki

    المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1112-1115 Aug, 2018

    Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Sintering mechanism of micron/submicron-size silver particles

    المؤلفون: Yeom, Jeyun, Li, Cai-Fu, Suganuma, Katsuaki

    المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :121-124 Apr, 2018

    Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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  8. 8
    مؤتمر
    Identification of IMCs at SAC/Fe-Ni interface during solid-state aging at 125°C

    المؤلفون: Liu, Zhi-Quan, Gao, Li-Yin, Li, Cai-Fu

    المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-5 Sep, 2016

    Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)

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  9. 9
    دورية أكاديمية
    Research progress on the intrinsic capacity in the elderly. (English)

    المؤلفون: LI Yao, XU Li-juan, LI Shi-ke, WANG Wen-hua, LI Cai-fu

    المصدر: Chinese Journal of Convalescent Medicine / Zhongguo Liaoyang Yixue; sep2024, Vol. 33 Issue 9, p73-76, 4p

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  10. 10
    مؤتمر
    Transmission electron microscopy investigations on the growth of tin whiskers from CeSn3 substrate

    المؤلفون: Li, Cai-Fu, Liu, Zhi-Quan, Shang, Jian-Ku

    المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

    Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

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