المؤلفون: Yang, X., Wang, Z., Hu, X.S., Kim, C.H., Yu, S., Pajic, M., Manohar, R., Chen, Y., Li, H.H.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(3):1683-1689 Mar, 2024

المؤلفون: Zhao, F.S., Zhang, Z.H., Shao, M.H., Bi, Y.J., Zhao, Y.Q., Wang, Z.W., Li, Y., Li, H.H., Xu, X.G., He, Y.Y.

المصدر: Materials Research. January 2021 24(4)

مصطلحات موضوعية: Plasma Nitriding, Hollow Cathodic Source, Hardness, Friction

وصف الملف: text/html

URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392021000400223

المؤلفون: WANG, Y.H., MA, Y.L., FENG, G.J., LI, H.H.

المصدر: Planta Daninha. January 2018 36

مصطلحات موضوعية: temperature, light, osmotic potential, heat-shock, burial depth

وصف الملف: text/html

URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0100-83582018000100268

المؤلفون: Hanson, E., Li, S., Qian, X., Li, H.H., Chen, Y.

المصدر: IEEE Transactions on Computers IEEE Trans. Comput. Computers, IEEE Transactions on. 72(3):880-892 Mar, 2023

المؤلفون: Li, H.H.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 70(12):4678-4678 Dec, 2023

المؤلفون: Liu, Z.K., Liu, W.D., Zhang, Y., Qian, L.Q., Zheng, W.Y., Yu, Z.R., Li, H.H., Wu, G., Liu, H., Chen, Y., Xie, Q.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(8):1-4 Nov, 2021

المؤلفون: Li, H.H.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 70(1):1-2 Jan, 2023

المؤلفون: Li, H.H.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 69(12):4730-4730 Dec, 2022

المؤلفون: Li, H.H., Alameldeen, A.R., Mutlu, O.

المصدر: IEEE Design & Test IEEE Des. Test Design & Test, IEEE. 39(2):46-47 Apr, 2022

المؤلفون: Yang, W.H., Aygören-Pürsün, E., Martinez-Saguer, I., Maurer, M., Farkas, H., Perosa, M., Bernstein, J., Busse, P., Jacobs, J.S., Li, H.H., Lumry, W.R., Rehman, S.M., Tachdjian, R., Wedner, H.J., Weinstein, M.E., Maurer, Marcus, Lumry, William R., Li, H. Henry, Aygören-Pürsün, Emel, Busse, Paula J., Jacobs, Joshua, Nurse, Christina, Ahmed, Mariam A., Watt, Maureen, Yu, Ming

المصدر: In The Journal of Allergy and Clinical Immunology: In Practice January 2024 12(1):201-211