-
1دورية أكاديمية
المؤلفون: Huang, Jian, Qin, Tian-Shou, Bo, Yun, Li, Yu-Jin, Liu, Rong-Sheng, Yu, Yang, Li, Xiao-Dong, He, Jin-Can, Ma, Ai-Xin, Tao, Da-Peng, Ren, Wen-JunAff3, IDs12035024043221_cor11, Peng, Jun
المصدر: Molecular Neurobiology. :1-11
-
2مؤتمر
المؤلفون: Yang, Bo-Jiun, Chen, Tai-Yu, Pan, Tsung-Yu, Lin, Bing-Yeh, Li, Yu-Jin, Hsu, Wen-Sung
المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022
Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
-
3مؤتمر
المؤلفون: Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, K.N., Lin, Benson Tzu-Hung, Chang, Chia-Cheng, Chen, Chih
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :995-1000 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
-
4مؤتمر
المؤلفون: Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, King-Ning, Chen, Chih
المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :91-94 Oct, 2020
Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
-
5مؤتمر
المؤلفون: Hsu, Wei-You, Li, Yu-Jin, Tseng, I-Hsin, Lin, Benson Tzu-Hung, Chang, Chia-Cheng, Chen, Chih
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :906-911 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
-
6مؤتمر
المؤلفون: Tseng, I-Hsin, Li, Yu-Jin, Lin, Benson, Chang, Chia-Cheng, Chen, Chih
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1328-1332 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
-
7مؤتمر
المؤلفون: Li, Yu-Jin, Theng, Chih-Han, Tseng, I-Hsin, Chen, Chih, Lin, Benson, Chang, Chia-Cheng
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :758-762 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
-
8مؤتمر
المؤلفون: Juang, Jing Ye, Shie, Kai Cheng, Hsu, Po-Ning, Li, Yu Jin, Tu, K N, Chen, Chih
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :642-647 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
-
9مؤتمر
المؤلفون: Juang, Jing Ye, Cheng Shie, Kai, Li, Yu Jin, Tu, K N, Chen, Chih
المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :212-215 Apr, 2019
Relation: 2019 International Conference on Electronics Packaging (ICEP)
-
10مؤتمر
المؤلفون: Li, Yu-Jin, HSU, WEI-YU, Lin, Benson, Chang, ChiaCheng, Chen, Chih
المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :1-4 Apr, 2019
Relation: 2019 International Conference on Electronics Packaging (ICEP)
Find this article in full text from Springer Verlag. 
Full Text Finder