المؤلفون: Yeh, J.-Y., Liao, S.-C., Wang, Y.-T., Chen, Y.-J.

المصدر: 2019 IEEE Social Implications of Technology (SIT) and Information Management (SITIM) Social Implications of Technology (SIT) and Information Management (SITIM), 2019 IEEE. :1-6 Nov, 2019

Relation: 2019 IEEE Social Implications of Technology (SIT) and Information Management (SITIM)

المؤلفون: Ju, C.-C., Liu, T.-M., Chang, Y.-C., Wang, C.-M., Tsai, C.-H., Chen, Y.-J., Wu, T.H., Lin, H.-M., Chou, H.-L., Chen, A., Wang, A.-H.B., Gu, W., Hsieh, W., Chang, J.-Y., Liao, S.-C., Ho, C.T., Chu, L., Wei, S., Wang, C., Jou, K.

المصدر: 2020 IEEE International Solid-State Circuits Conference - (ISSCC) Solid-State Circuits Conference - (ISSCC), 2020 IEEE International. :326-328 Feb, 2020

Relation: 2020 IEEE International Solid-State Circuits Conference - (ISSCC)

المؤلفون: Bergmann, L., Düring, P., Agrestini, S., Efimenko, A., Liao, S. -C., Hu, Z., Gargiani, P., Choi, C. -J., Baik, H., Park, D. -S., Dörr, K., Rata, A. D.

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2001.02083

المؤلفون: Chang, H.-C., Liao, S.-C., Cheng, C.-L., Wen, J.-H., Hsieh, H.-S., Lai, C.-H., Fang, W.

المصدر: 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2016 IEEE 29th International Conference on. :218-221 Jan, 2016

Relation: 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Cheng, I., Liao, S.-C., Chen, K.-S., Yang, M.-R., Lin, M.-T., Liu, Y.-C.

المصدر: 2016 International Conference on Advanced Materials for Science and Engineering (ICAMSE) Advanced Materials for Science and Engineering (ICAMSE), International Conference on. :416-418 Nov, 2016

Relation: 2016 International Conference on Advanced Materials for Science and Engineering (ICAMSE)

المؤلفون: Chang, H.-C., Sung, W.-L, Hsieh, H.-S., Wen, J.-H., Fu, C.-C., Liao, S.-C., Lai, C.-H., Lai, W.-C., Chang, C.-H., Chang, C.-P., Chen, C.-H., Fang, W.

المصدر: 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on. :1189-1192 Jan, 2014

Relation: 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Chang, H.-C., Liao, S.-C., Hsieh, H.-S., Lin, S.-J., Lai, C.-H., Chen, R., Fang, W.

المصدر: 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on. :685-688 Jan, 2013

Relation: 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Chen, J. C., Tzeng, P. J., Chen, S. C., Wu, C. Y., Chen, C. C., Hsin, Y. C., Lau, J. H., Hsu, Y. F., Shen, S. H., Liao, S. C., Ho, C. H., Lin, C. H., Ku, T. K., Kao, M. J.

المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1389-1394 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

المؤلفون: ChiaHua Ho, Shen, T. Y., Hsu, P. Y., Chang, S. C., Wen, S. Y., Lin, M. H, Wang, P. K., Liao, S. C., Chou, C. S., Peng, K. M., Wu, C. M., Chang, W. H., Chen, Y. H., Chen, F., Lin, L. W., Tsai, T. H., Lim, S. F., Yang, C. J., Shieh, M. H., Liao, H. H., Lin, C. H., Pai, P. L., Chan, T. Y., Chiao, Y. C.

المصدر: 2016 IEEE Symposium on VLSI Technology VLSI Technology, 2016 IEEE Symposium on. :1-2 Jun, 2016

Relation: 2016 IEEE Symposium on VLSI Technology

المؤلفون: Chen, J.-C., Lau, J. H., Tzeng, P.-J., Chen, S.-C., Wu, C.-Y., Chen, C. C., Hsin, Y. C., Hsu, Y.-F., Shen, S. H., Liao, S.-C., Ho, C.-H., Lin, C.-H., Ku, T.-K., Kao, M.-J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):956-963 Jun, 2012