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1مؤتمر
المؤلفون: Al-Aqel, A.A., Lim, B.K., Mohd Noor, E.E., Yap, T.C., Alkaff, S.A.
المصدر: 2016 International Conference on Robotics, Automation and Sciences (ICORAS) Robotics, Automation and Sciences (ICORAS), International Conference on. :1-6 Nov, 2016
Relation: 2016 International Conference on Robotics, Automation and Sciences (ICORAS)
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2مؤتمر
المؤلفون: Kanth, K.R., Poh, F.K.S., Lim, B.K., Chong, D.Y.R., Sun, A., Tan, H.B.
المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :577-582 2005
Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference
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3مؤتمر
المؤلفون: Lim, B.K., Poh, F.K.S., Chong, D.Y.R., Koh, S.W.
المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :197-204 2004
Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
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4مؤتمر
المؤلفون: Chong, D.Y.R., Lee, W.E., Lim, B.K., Pang, J.H.L., Low, T.H.
المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:203-210 Vol.2 2004
Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems
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5مؤتمر
المؤلفون: Chong, D.Y.R., Lee, W.E., Pang, J.H.L., Low, T.H., Lim, B.K.
المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :600-605 2003
Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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6مؤتمر
المؤلفون: Bailey, D.G., Irecki, D., Lim, B.K., Yang, L.
المصدر: Proceedings First IEEE International Workshop on Electronic Design, Test and Applications '2002 Electronic design, test and applications Electronic Design, Test and Applications, 2002. Proceedings. The First IEEE International Workshop on. :501-503 2002
Relation: Proceedings First IEEE International Workshop on Electronic Design, Test and Applications '2002
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7مؤتمر
المؤلفون: Lau, W.S., Yang, Peizhen, Ho, V., Lim, B.K., Siah, S.Y., Chan, L.
المصدر: 2008 IEEE International Conference on Electron Devices and Solid-State Circuits Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on. :1-4 Dec, 2008
Relation: 2008 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
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8مؤتمر
المؤلفون: Kim, S.G., Hyun, C.S., Park, D., Kim, S.J., Cho, T.H., Kang, H.J., Lee, S.H., Suk, J.G., Lim, B.K., Jeon, Y.S., Hwang, K.H., Hong, H.S., Jeon, S.G., Lee, K.Y., Oh, K.S., Park, D.G.
المصدر: 2005 International Semiconductor Device Research Symposium Semiconductor Device Research Symposium, 2005 International. :113-114 2005
Relation: 2005 International Semiconductor Device Research Symposium
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9مؤتمر
المؤلفون: Chong, D.Y.R., Che, F.X., Xu, L.H., Toh, H.J., Pang, J.H.L., Xiong, B.K., Lim, B.K.
المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :8 pp. 2006
Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference
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10مؤتمر
المؤلفون: Retuta, D.V., Lim, B.K., Tan, H.B.
المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :9 pp. 2006
Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference