المؤلفون: Argunova, T. S.^{Aff1, IDS1027451023070030_cor1}, Kohn, V. G., Lim, J.-H., Krymov, V. M., Martyushov, S. Yu.

المصدر: Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques. 17(Suppl 1):S20-S27

المؤلفون: Lee, T. Y., Yamane, K., Hau, L. Y., Chao, R., Chung, N. L., Naik, V. B., Sivabalan, K., Kwon, J., Lim, J. H., Neo, W. P., Khua, K., Thiyagarajah, N., Jang, S. H., Behin-Aein, B., Toh, E. H., Otani, Y., Zeng, D., Balasankaran, N., Goh, L. C., Ling, T., Hwang, J., Zhang, L., Low, R., Tan, S. L, Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y.

المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-4 Apr, 2020

Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Lim, J. H., Raghavan, N., Kwon, J. H., Lee, T. Y., Chao, R., Chung, N. L., Yamane, K., Thiyagarajah, N., Naik, V. B., Pey, K. L.

المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-5 Apr, 2020

Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Oon, W. L., Lin, H. S., Pua, C. H., Lim, J. H., Lim, S. K., Rahman, F. A.

المصدر: 2019 IEEE 9th International Nanoelectronics Conferences (INEC) Nanoelectronics Conferences (INEC), 2019 IEEE 9th International. :1-4 Jul, 2019

Relation: 2019 IEEE 9th International Nanoelectronics Conferences (INEC)

المؤلفون: Naik, V. B., Lim, J. H., Yamane, K., Zeng, D., Yang, H., Thiyagarajah, N., Kwon, J., Chung, N. L., Chao, R., Ling, T., Lee, K.

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-4 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Naik, V. B., Lim, J. H., Yamane, K., Kwon, J., B., Behin-Aein, Chung, N. L., K, S., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Jang, S.H., Balasankaran, N., Neo, W. P., Ling, T., Ting, J. W., Yoon, H., Mueller, J., Pfefferling, B., Kallensee, O., Merbeth, T., Seet, C.S., Wong, J., You, Y. S., Soss, S., Chan, T. H., Siah, S. Y.

المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :6B.3-1-6B.3-6 Mar, 2022

Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Oon, W. L., Lin, H. S., Pua, C. H., Lim, J. H., Lim, S. K., Ong, C. F., Rahman, F. A.

المصدر: 2018 IEEE Student Conference on Research and Development (SCOReD) Research and Development (SCOReD), 2018 IEEE Student Conference on. :1-4 Nov, 2018

Relation: 2018 IEEE Student Conference on Research and Development (SCOReD)

المؤلفون: Naik, V. B., Yamane, K., Kwon, J., K, S., Lim, J. H., Ali, Z., Behin-Aein, B., Chung, N. L., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Dixit, H., Jang, S. H., Balasankaran, N., Tan, F., Neo, W. P., Goh, L. C., Toh, E. H., Ling, T., Ting, J. W., Yoon, H., Congedo, G., Mueller, J., Pfefferling, B., Kallensee, O., Vogel, A., Merbeth, T., Seet, C. S., Wong, J., Bordelon, J., You, Y. S., Soss, S., Chan, T. H., Quek, E., Siah, S. Y.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Lee, T. Y., Yamane, K., Kwon, J., Naik, V. B., Otani, Y., Zeng, D., Lim, J. H., Sivabalan, K., Chiang, C., Huang, Y., Jang, S. H., Hau, L. Y., Chao, R., Chung, N. L., Neo, W. P., Khua, K., Thiyagarajah, N., Ling, T., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Wong, J., Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Siah, S. Y.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Lee, T. Y., Yamane, K., Otani, Y., Zeng, D., Kwon, J., Lim, J. H., Naik, V. B., Hau, L. Y., Chao, R., Chung, N. L., Ling, T., Jang, S. H., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Ting, J. W., Chang, J., Seet, C. S., Ong, S., You, Y. S., Woo, S. T., Chan, T. H., Siah, S. Y.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :11.6.1-11.6.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)