يعرض 1 - 10 نتائج من 125 نتيجة بحث عن '"Lim, Teck Guan"', وقت الاستعلام: 0.80s تنقيح النتائج
  1. 1
    مؤتمر
    A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers

    المؤلفون: Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Sandra, San, Jong, Ming Chinq, Lai Yee, Chia, Long, Lau Boon, Soon Wee Ho, David, Choong, Chong Ser, Liang, Ding, Tu, Xiaoguang, Wang, Wanjun, Tan, Chee-Keong, See, Alison, Wang, Hsiu-Che, Coccioli, Roberto, Tan, Ronson, Nagarajan, Radhakrishnan, Bhattacharya, Surya

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1398-1403 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters

    المؤلفون: Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1175-1178 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications

    المؤلفون: Li, Xin, Gourikutty, Sajay B. N., Wu, Jiaqi, Lim, Teck Guan, Guo, Pengfei, Davies, Jaye C., Sing Chee Koh, Edward, Long, Lau Boon, Chinq Jong, Ming, Li, Chao, Lo, Guo-Qiang, Bhattacharya, Surya, Liow, Jason Tsung-Yang

    المصدر: 2024 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2024. :1-3 Mar, 2024

    Relation: 2024 Optical Fiber Communications Conference and Exhibition (OFC)

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  4. 4
    مؤتمر
    Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Photonic Transmitter Enabled by FOWLP Electronic-Photonic Integration

    المؤلفون: Li, Xin, Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Davies, Jaye C., Chee Koh, Edward Sing, Boon Long, Lau, Choong, Chong Ser, Sandra, San, Bhattacharya, Surya, Liow, Jason Tsung-Yang

    المصدر: 2024 IEEE Silicon Photonics Conference (SiPhotonics) Silicon Photonics Conference (SiPhotonics), 2024 IEEE. :1-2 Apr, 2024

    Relation: 2024 IEEE Silicon Photonics Conference (SiPhotonics)

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  5. 5
    مؤتمر
    A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

    المؤلفون: Nair Gourikutty, Sajay Bhuvanendran, Long, Lau Boon, Wei, Seit Wen, Jong, Ming Chinq, Wee Ho, David Soon, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Choong, Chong Ser, Yee, Chia Lai, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :207-211 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer

    المؤلفون: Lim, Teck Guan, Zho, Lin, Tippabhotla, Sasi Kumar, Lin, Ji, Chinq, Jong Ming, Wu, JiaQi, Gongyue, Tang, Ching, Eva Wai Leong, Ng, Yong Chyn, Chui, King Jien, Lu, Wei Jia, Goh, Chee Heng, Lin Pek, Sek, Loh, Jun Wei Agnes

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1838-1843 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Attachment of Alignment Fibre on Interposer for Fibre Optic Array Assembly

    المؤلفون: Wai, Leong Ching, Lim, Teck Guan, Chong, Ser Choong, Loh, Woon Leng

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :128-133 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  8. 8
    مؤتمر
    Thermal modelling, characterization and optimization of 2.5D heterogeneous integrated platform for RF front end

    المؤلفون: Chen, Haoran, Lim, Teck Guan, Tang, Gongyue

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :941-944 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  9. 9
    مؤتمر
    Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-interposer Platform for III-V HEMT Flip Chip

    المؤلفون: Chen, Haoran, Lim, Teck Guan, Tang, Gongyue

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1030-1035 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications

    المؤلفون: Gourikutty, Sajay Bhuvanendran Nair, Jong, Ming Chinq, Kanna, Chockanathan Vinoth, Ho, David Soon Wee, Wei, Seit Wen, Siang, Sharon Lim Pei, Wu, Jiaqi, Lim, Teck Guan, Mandal, Rathin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :422-427 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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