المؤلفون: Liao, S., Yang, L., Chiu, T.K., You, W.X., Wu, T.Y., Yang, K.F., Woon, W.Y., Ho, W.D., Lin, Z.C., Hung, H.Y., Huang, J.C., Huang, S.T., Tsai, M.C., Yu, C.L., Chen, S.H., Hu, K.K., Shih, C.C., Chen, Y.T., Liu, C.Y., Lin, H.Y., Chung, C.T., Su, L., Chou, C.Y., Shen, Y.T., Chang, C.M., Lin, Y.T., Lin, M.Y., Lin, W.C., Chen, B.H., Hou, C.S., Lai, F., Chen, X., Wu, J., Lin, C.K., Cheng, Y.K., Lin, H.T., Ku, Y.C., Lin, S.S., Lu, L.C., Jang, S.M., Cao, M.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Kuo, J.Y., Lee, W., Su, K.W., Lin, C.K.

المصدر: 2023 Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2023. :89-90 Jun, 2023

Relation: 2023 Silicon Nanoelectronics Workshop (SNW)

المؤلفون: Lee, W., Tsou, C., Liao, Z., Lu, P., Lin, T., Lee, S., Lin, C.K., Shieh, G.

المصدر: IEEE Access Access, IEEE. 9:80264-80274 2021

المؤلفون: Huang, J.Y., Lin, C.K., Bian, Y.L., Xie, H.L., Chai, H.W., Ding, Y.Y., Luo, S.N.

المصدر: In International Journal of Mechanical Sciences 15 October 2024 280

المؤلفون: Chen, J., Lin, C.K., Lin, C., Yu, F., Li, K., Tsai, L.

المصدر: IEEE Access Access, IEEE. 8:178770-178781 2020

المؤلفون: Mukhopadhyay, S., Kundu, A., Lee, Y.W., Hsieh, H. D., Huang, D.S., Horng, J.J., Chen, T.H., Lee, J.H., Tsai, Y.S., Lin, C.K., Lu, Ryan, He, Jun

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :17.4.1-17.4.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Yang, S.H., Sheu, J.Y., Ieong, M.K., Chiang, M.H., Yamamoto, T., Liaw, J.J., Chang, S.S., Lin, Y.M., Hsu, T.L., Hwang, J.R., Ting, J.K., Wu, C.H., Ting, K.C., Yang, F.C., Liu, C.M., Wu, I.L., Chen, Y.M., Chent, S.J., Chen, K.S., Cheng, J.Y., Tsai, M.H, Chang, W., Chen, R., Chen, C.C., Lee, T.L., Lin, C.K, Yang, S.C., Sheu, Y.M., Tzeng, J.T., Lu, L.C., Jang, S.M, Diaz, C.H., Mii, YJ

المصدر: 2011 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2011 IEEE. :1-5 Sep, 2011

Relation: 2011 IEEE Custom Integrated Circuits Conference - CICC 2011

المؤلفون: Lin, C.K., Li, S.J., Tsai, S.H., Wang, C.W., Wang, Y.C., Wu, P.H., Li, J.Y.

المصدر: 2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on. :1-4 Aug, 2011

Relation: 2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Huang, D. S., Lee, J. H., Tsai, Y. S., Wang, Y. F., Huang, Y.S., Lin, C.K., Lu, Ryan, He, Jun

المصدر: 2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :6F.7-1-6F.7-5 Mar, 2018

Relation: 2018 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Yang, M.T., Ho, P.P.C., Lin, C.K., Yeh, T.J., Wang, Y.J., Voinigescu, S.P., Tazlauanu, M., Chia, Y.T., Young, K.L.

المصدر: 2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535) Microwave symposium digest Microwave Symposium Digest, 2004 IEEE MTT-S International. 2:1049-1052 Vol.2 2004

Relation: 2004 IEEE MTT-S International Microwave Symposium Digest