المؤلفون: Hsieh, Chang-Hsuan, Yang, Jen-Chieh, Lin, Hung-Yi, Kuo, Lin-Jing, Wang, Sheng-De

المصدر: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom) TRUSTCOM Trust, Security and Privacy in Computing and Communications (TrustCom), 2023 IEEE 22nd International Conference on. :2424-2431 Nov, 2023

Relation: 2023 IEEE 22nd International Conference on Trust, Security and Privacy in Computing and Communications (TrustCom)

المؤلفون: Yang, Ching-Nung, Lin, Hung-Yi, Wang, Chang-Ji

المصدر: 2023 8th International Conference on Automation, Control and Robotics Engineering (CACRE) Automation, Control and Robotics Engineering (CACRE), 2023 8th International Conference on. :68-72 Jul, 2023

Relation: 2023 8th International Conference on Automation, Control and Robotics Engineering (CACRE)

المؤلفون: Yang, Ching-Nung, Lin, Hung-Yi, Hsueh, Hao-Chen, Fan, Kai-Jie

المصدر: 2023 6th International Conference on Artificial Intelligence and Big Data (ICAIBD) Artificial Intelligence and Big Data (ICAIBD), 2023 6th International Conference on. :603-608 May, 2023

Relation: 2023 6th International Conference on Artificial Intelligence and Big Data (ICAIBD)

المؤلفون: Kung, Cheng-Yuan, Lin, Hung-Yi, Kuo, Chin-Cheng, Wu, Cheng-Syuan, Chen, Yu-Ting, Hsieh, Meng-Wei, Hsieh, Yu-Chang, Lee, Pao-Nan

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Tsai, Shun-Hung, Tsai, Hau-En, Lin, Hung-Yi, Tsai, Men-Shen

المصدر: 2023 14th IIAI International Congress on Advanced Applied Informatics (IIAI-AAI) IIAI-AAI Advanced Applied Informatics (IIAI-AAI), 2023 14th IIAI International Congress on. :752-753 Jul, 2023

Relation: 2023 14th IIAI International Congress on Advanced Applied Informatics (IIAI-AAI)

المؤلفون: Huang, Jun-Yu, Hung, Hsiao-Chun, Hsu, Kung-Chi, Chen, Chia-Hsun, Lee, Pei-Hsi, Lin, Hung-Yi, Lin, Bo-Yen, Leung, Man-kit, Chiu, Tien-Lung, Lee, Jiun-Haw, Friend, Richard H., Wu, Yuh-Renn

المصدر: Adv. Theory Simul. 2022, 2200633

مصطلحات موضوعية: Condensed Matter - Materials Science, Physics - Applied Physics

URL الوصول: http://arxiv.org/abs/2305.19540

المؤلفون: Lin, Hung-Yi, Song, Yu-Lin, Chang, Luh-Maan

المصدر: 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2021 Asia-Pacific International Symposium on. :1-4 Sep, 2021

Relation: 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

المؤلفون: Huang, Jun-Yu, Hung, Hsiao-Chun, Hsu, Kung-Chi, Chen, Chia-Hsun, Lee, Pei-Hsi, Lin, Hung-Yi, Lin, Bo-Yen, Leung, Man-Kit, Chiu, Tien-Lung, Lee, Jiun-Haw, Wu, Yuh-Renn

المصدر: 2022 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) Numerical Simulation of Optoelectronic Devices (NUSOD), 2022 International Conference on. :83-84 Sep, 2022

Relation: 2022 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)

المؤلفون: Lin, Hung-Yi^{Aff1, IDs4081502301523z_cor1}, Tsai, Shun-Hung^{Aff2, Aff3}, Chen, Kuan-Yo

المصدر: International Journal of Fuzzy Systems. 25(6):2423-2438

المؤلفون: Liu, Jun-Wei, Lin, Hung-Yi, Huang, Yu-Fen, Kao, Hsuan-Kai, Su, Li

المصدر: ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2020 - 2020 IEEE International Conference on. :3787-3791 May, 2020

Relation: ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)