المؤلفون: Lee, Dem, Lee, Jeffrey ChangBing, Chen, Cheng Chih, Chang, Graver, Lin, Jandel

المصدر: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International. :271-274 Oct, 2013

Relation: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Jeffrey, ChangBing Lee, Chang, Graver, Chen, Cherie, ChengChih Chen, Lin, Jandel

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :212-216 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Lee, Jeffrey ChangBing, Chang, Graver, Chen, Cherie, Chen, ChengChih, Lin, Jandel

المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1083-1088 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Lee, Jeffrey ChangBing, Chang, Graver, Chen, Cherie, Lin, Jandel

المصدر: 18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-6 Sep, 2011

Relation: 2011 18th European Microelectronics and Packaging Conference (EMPC)

المؤلفون: Liu, Tao-Chi, Chen, Chih, Liu, Shih-Ting, Chang, Ming-Lun, Lin, Jandel

المصدر: Journal of Materials Science: Materials in Electronics. October 2011 22(10):1536-1541

المؤلفون: Lin, Horng-Chih, Lin, Hsiao-Yi, Chang, Chun-Yen, Jung, Tz-Gwei, Wang, P. J., Deng, Ray-Chern, Lin, Jandel

المصدر: Journal of Applied Physics; 8/1/1994, Vol. 76 Issue 3, p1572, 6p

مصطلحات موضوعية: BORON, DOPED semiconductors, THIN films, SILICON, CHEMICAL vapor deposition

المؤلفون: Lin, Horng-Chih, Jung, Tze-Guei, Lin, Hsiao-Yi, Chang, Chun-Yen, Lei, Tan-Fu, Wang, P. J., Deng, Ray-Chern, Lin, Jandel, Chao, Chih-Yeh

المصدر: Journal of Applied Physics; 11/1/1993, Vol. 74 Issue 9, p5395, 7p, 1 Black and White Photograph, 2 Diagrams, 6 Graphs

مصطلحات موضوعية: POLYCRYSTALLINE semiconductors, CHEMICAL vapor deposition, THIN films

المؤلفون: Huang Sheng-Liang, Wu Shiu-Chin, Niu Huan, Lin Jandel, Deng Ray-Chern

المصدر: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 79:536-538

مصطلحات موضوعية: Nuclear and High Energy Physics, Materials science, Hydrogen, Physics::Instrumentation and Detectors, technology, industry, and agriculture, Analytical chemistry, chemistry.chemical_element, Hydrogen content, Elastic recoil detection, Secondary ion mass spectrometry, Condensed Matter::Materials Science, chemistry.chemical_compound, chemistry, Silicon nitride, Plasma-enhanced chemical vapor deposition, Thin film, Instrumentation

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::93d3a187ef80ce61f177e729bb3efab0
https://doi.org/10.1016/0168-583x(93)95408-w

المؤلفون: Lin, Hsiao-Yi, Lei, Tan Fu, Lin, Horng-Chih, Chang, Chun-Yen, Twu, Ruey-Ching, Deng, Ray-Chern, Lin, Jandel

المصدر: In Solid State Electronics 1995 38(12):2029-2033