المؤلفون: Cheng, Wei-Yuan, Yang, Chen-Tsai, Lin, Jie-Mo, Chen, Wei-Han, Wang, Tai-Jui, Lee, Yuh-Zheng

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :386-391 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yuh-Zheng Lee, Tai-Jui Wang, Wei-Han Chen, Wei-Yuan Cheng, Lin Jie-Mo, Chen-Tsai Yang

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Liquid-crystal display, Computer science, Process (computing), Electromagnetic compatibility, Fan-out, 02 engineering and technology, Simulation system, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, Automotive engineering, law.invention, De bonding, law, 0103 physical sciences, 0210 nano-technology, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f1fdf7c21b3a656d7081283bdc44a12
https://doi.org/10.1109/ectc.2018.00065

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المؤلفون: Chang, Jia-Yaw, Lin, Jie-Mo, Su, Li-Fong, Chang, Chia-Fu

المصدر: ACS Applied Materials & Interfaces; September 2013, Vol. 5 Issue: 17 p8740-8752, 13p

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