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1مؤتمر
المؤلفون: Lin, Kuan-Ting, Ker, Ming-Dou
المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024
Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
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2مؤتمر
المؤلفون: Lin, Chun-Hsien, Lin, Kuan-Ting, Wang, Pi-Chung
المصدر: 2023 IEEE International Conference on Omni-layer Intelligent Systems (COINS) Omni-layer Intelligent Systems (COINS), 2023 IEEE International Conference on. :1-6 Jul, 2023
Relation: 2023 IEEE International Conference on Omni-layer Intelligent Systems (COINS)
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3تقرير
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4كتاب إلكتروني
المؤلفون: Chen, HuanAff39, Hsu, Hsin-YaoAff39, Lin, Kuan-TingAff39, Hsieh, Jia-YouAff39, Chang, Yi-FengAff39, Cheng, Bo-ChaoAff40
المساهمون: Angrisani, Leopoldo, Series EditorAff1, Arteaga, Marco, Series EditorAff2, Chakraborty, Samarjit, Series EditorAff3, Chen, Jiming, Series EditorAff4, Chen, Shanben, Series EditorAff5, Chen, Tan Kay, Series EditorAff6, Dillmann, Rüdiger, Series EditorAff7, Duan, Haibin, Series EditorAff8, Ferrari, Gianluigi, Series EditorAff9, Ferre, Manuel, Series EditorAff10, Jabbari, Faryar, Series EditorAff11, Jia, Limin, Series EditorAff12, Kacprzyk, Janusz, Series EditorAff13, Khamis, Alaa, Series EditorAff14, Kroeger, Torsten, Series EditorAff15, Li, Yong, Series EditorAff16, Liang, Qilian, Series EditorAff17, Martín, Ferran, Series EditorAff18, Ming, Tan Cher, Series EditorAff19, Minker, Wolfgang, Series EditorAff20, Misra, Pradeep, Series EditorAff21, Mukhopadhyay, Subhas, Series EditorAff22, Ning, Cun-Zheng, Series EditorAff23, Nishida, Toyoaki, Series EditorAff24, Oneto, Luca, Series EditorAff25, Panigrahi, Bijaya Ketan, Series EditorAff26, Pascucci, Federica, Series EditorAff27, Qin, Yong, Series EditorAff28, Seng, Gan Woon, Series EditorAff29, Speidel, Joachim, Series EditorAff30, Veiga, Germano, Series EditorAff31, Wu, Haitao, Series EditorAff32, Zamboni, Walter, Series EditorAff33, Zhang, Junjie James, Series EditorAff34, Tan, Kay Chen, Series EditorAff35, Hung, Jason C., editorAff36, Yen, Neil, editorAff37, Chang, Jia-Wei, editorAff38
المصدر: Frontier Computing on Industrial Applications Volume 4 : Proceedings of Theory, Technologies and Applications (FC 2023). 1134:115-126
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5دورية أكاديمية
المؤلفون: Chen, Po-YinAff1, Aff2, Chen, Yung-Chih, Chen, Po-PangAff1, Aff3, Lin, Kuan-TingAff1, Aff4, Sargsyan, Karen, Hsu, Chao-PingAff5, Aff6, Aff7, Wang, Wei-LeAff1, Aff2, Aff4, Hsia, Kuo-ChiangAff1, Aff2, Aff3, Ting, See-YeunAff1, Aff2, Aff7, IDs41467024510171_cor9
المصدر: Nature Communications. 15(1)
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6تقرير
المؤلفون: Aziz, Fahad, Lin, Kuan Ting, Wen, Ping Yi, Samina, Lin, Yu Chen, Wiegand, Emely, Lee, Ching-Ping, Cheng, Yu-Ting, Chen, Ching-Yeh, Chien, Chin-Hsun, Hsieh, Kai-Min, Huang, Yu-Huan, Hou, Ian, Chen, Jeng-Chung, Lin, Yen-Hsiang, Kockum, Anton Frisk, Lin, Guin Dar, Hoi, Io-Chun
مصطلحات موضوعية: Quantum Physics
URL الوصول: http://arxiv.org/abs/2302.07442
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7مؤتمر
المؤلفون: Lin, Kuan-Ting, Chiu, Ching-Te, Chang, Jheng-Yi, Hsiao, Shan-Chien
المصدر: 2021 IEEE International Symposium on Circuits and Systems (ISCAS). :1-5 May, 2021
Relation: 2021 IEEE International Symposium on Circuits and Systems (ISCAS)
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8مؤتمر
المؤلفون: Sakuma, Ryoko, Lin, Kuan-Ting, Kimura, Fuminobu, Kajihara, Yusuke
المصدر: 2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) Infrared, Millimeter and Terahertz Waves (IRMMW-THz),2022 47th International Conference on. :1-2 Aug, 2022
Relation: 2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)
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9دورية أكاديمية
المؤلفون: Yuan, Mei-Hua, Lin, Kuan-Ting, Pan, Shu-Yuan, Yang, Chih-Kai
المصدر: In Science of the Total Environment 10 November 2024 950
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10مؤتمر
المؤلفون: Hsu, Lien-Chih, Chiu, Ching-Te, Lin, Kuan-Ting
المصدر: 2019 IEEE International Conference on Image Processing (ICIP) Image Processing (ICIP), 2019 IEEE International Conference onhttps://idams.ieee.org/idams/custom/properties/properties.jsp#. :4609-4613 Sep, 2019
Relation: 2019 IEEE International Conference on Image Processing (ICIP)