نتائج البحث - "Lin, Lemon"

تحديد النتيجة رقم 1
1

مؤتمر

Enhanced System Level Channel Characterization Methodology with Seamless Correlation among Hardware, Signal Integrity and Electrical Validation for Design Robustness

المؤلفون: Hsu, Jimmy, Wu, Kuan-Ting, Ho, Brian, Lin, Lemon, Chen, Betty, Su, Thonas, Wu, Steven, Hung, Gary, Tseng, Jim

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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تحديد النتيجة رقم 2
2

مؤتمر

High-speed Data Center PCB Design Challenges and Findings by Intel ® Automatic In-board Characterization

المؤلفون: Hsu, Jimmy, Hung, Gary, Tseng, Jim, Ho, Brian, Lin, Lemon, Su, Thonas

المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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تحديد النتيجة رقم 3
3

مؤتمر

Robotic System with Intel® Automatic In-Board Characterization for Customer Board Design Quality Check

المؤلفون: Hsu, Jimmy, Lin, Lemon, Ho, Brian, Hsiao, Neo, Chen, Denis, Su, Thonas, Zhang, Xinjun

المصدر: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :119-122 Dec, 2021

Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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