المؤلفون: Lin, Y. M., Chao, Y. C., Chung, C. L.

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :183-184 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

المؤلفون: Chang, Y. K., Liao, P. J., Yeong, S. H., Lin, Y.-M., Lee, J. H., Lin, C. T., Yu, Z., Tsai, W., McIntyre, P. C.

المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :3A.1-1-3A.1-5 Mar, 2022

Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Tang, Gaofei, Kwan, M.-H., Zhang, Zhaofu, He, Jiabei, Lei, Jiacheng, Su, R.-Y., Yao, F.-W., Lin, Y.-M., Yu, J.-L., Yang, Thomas, Chern, Chan-Hong, Tsai, Tom, Tuan, H. C., Kalnitsky, Alexander, Chen, Kevin J.

المصدر: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2018 IEEE 30th International Symposium on. :76-79 May, 2018

Relation: 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

المؤلفون: Lee, C.-K., Wang, J.-C., Lin, Y.-M., Zhan, C.-J., Shen, W.-W., Fu, H.-C., Lee, Y.-C., Chiang, C.-W., Chung, S.-C., Chen, S.-M., Fan, C.-W., Lo, W.-C., Lu, Y.J.

المصدر: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International. :336-339 Oct, 2015

Relation: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Li, Y. T., Huang, P. C., Tsai, F. S., Li, K. R., Lin, C. H., Lin, Z. J., Liu, Y. L., Sie, W. S., Hsu, S. K., Lin, Y. M., Lin, W. C., Liu, C.C., Lin, J.F., Wu, J. Y.

المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :186-189 Nov, 2014

Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

المؤلفون: Lin, Y. M., Hsu, S. K., Hsu, L. C., Hsu, C. H., Wu, C. L., Lee, W. K., Lin, W. C., Sie, W. S., Liu, Y. L., Lee, Y. T., Wang, Oliver, Huang, C. C., Lin, J. F., Wu, J. Y.

المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :221-224 Nov, 2014

Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

المؤلفون: Yu, Y. L., Lin, Y. M., Wang, H. C., Liaw, S. K., Minh, Hoa Le

المصدر: 2014 IEEE 5th International Conference on Photonics (ICP) Photonics (ICP), 2014 IEEE 5th International Conference on. :102-105 Sep, 2014

Relation: 2014 IEEE 5th International Conference on Photonics (ICP)

المؤلفون: Jiang, W. J., Lebedev, A., Lin, Y. M., Vorobeichik, I., Gopp, I., Plotskiy, A., Way, W. I.

المصدر: 2015 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2015. :1-3 Mar, 2015

Relation: 2015 Optical Fiber Communications Conference and Exhibition (OFC)

المؤلفون: Hsu, H. K., Lin, Y. M., Hsu, L. C., Li, Y. T., Liu, Y. L., Sie, W. S., Wang, Oliver, Huang, C. C., Wu, J. Y.

المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :63-65 Nov, 2014

Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)

المؤلفون: Sie, W. S., Liu, Y. L., Chen, J. L., Hong, W. C., Huang, R. P., Huang, P. C., Li, Y. T., Lin, C. H., Kung, C. H., Lin, Y. M., Lin, R. G., Hsu, H. K., Wang, Oliver, Lin, J. F.

المصدر: Proceedings of International Conference on Planarization/CMP Technology 2014 Planarization/CMP Technology (ICPT), 2014 International Conference on. :183-185 Nov, 2014

Relation: 2014 International Conference on Planarization/CMP Technology (ICPT)