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1مؤتمر
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020
Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
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المؤلفون: Hoang Linh Bach, Anqi Huang, Yue Teng, Hubert Rauh, Andreas Schletz, Michael P. M. Jank, Martin Marz
المصدر: 2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::787fb4b062379da818f6387a7960c773
https://doi.org/10.1109/wipda56483.2022.9955257 -
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المؤلفون: Christian Lenz, Steffen Ziesche, Kathrin Reinhardt, Stefan Korner, Andreas Schletz, Hoang Linh Bach, Ingo Schmidt, Michel Simon-Naiasek
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e90571b5aadce6aef1392ce5661d700c
https://doi.org/10.1109/estc55720.2022.9939430 -
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المؤلفون: Hoang Linh Bach, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März
المصدر: Journal of Microelectronics and Electronic Packaging. 16:176-181
مصطلحات موضوعية: 010302 applied physics, Computer Networks and Communications, 020208 electrical & electronic engineering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, Electrical and Electronic Engineering, 01 natural sciences, Electronic, Optical and Magnetic Materials
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c48e24de46438b9df1d85cc4c5d1bbf
https://doi.org/10.4071/imaps.952440 -
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المؤلفون: Michael Koegel, Linh Bach, Frank Altmann, Sebastian Brand
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Signal processing, Materials science, Artificial neural network, Mean squared error, business.industry, Acoustics, Deep learning, Acoustic microscopy, Ultrasonic sensor, Artificial intelligence, Porosity, business, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d84d5846f904219e4683fc04498c538
https://doi.org/10.1109/ectc32696.2021.00147 -
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المؤلفون: Daniel Dirksen, Christoph Friedrich Bayer, Christoph Blechinger, Hoang Linh Bach, Andreas Schletz, Tobias Maximilian Endres, Martin Marz
المساهمون: Publica
المصدر: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000028-000033
مصطلحات موضوعية: 010302 applied physics, Materials science, 020208 electrical & electronic engineering, High voltage, 02 engineering and technology, 01 natural sciences, Engineering physics, high temperature packaging, Power (physics), chemistry.chemical_compound, chemistry, Power electronics, visual_art, module concept, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, Silicon carbide, Embedding, ceramic embedding, Pharmacology (medical), Ceramic, Voltage
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b747d01ed278cc1d78b39e0a95f2939
https://doi.org/10.4071/2380-4491.2019.hiten.000028 -
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المؤلفون: Steffen Ziesche, Hoang Linh Bach, Andreas Schletz, Benjamin Bayer, Mario Groccia, Christian Lenz, Christoph Friedrich Bayer
المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: Interconnection, Materials science, Thermal resistance, 020208 electrical & electronic engineering, 02 engineering and technology, Semiconductor device, Engineering physics, chemistry.chemical_compound, chemistry, Power module, visual_art, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, Silicon carbide, Power semiconductor device, Junction temperature, Ceramic
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c2304f6f0d2289819ec4e82008e7290a
https://doi.org/10.1109/estc48849.2020.9229859 -
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المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
مصطلحات موضوعية: 010302 applied physics, Materials science, Fabrication, business.industry, 0211 other engineering and technologies, 02 engineering and technology, Semiconductor device, Substrate (printing), 01 natural sciences, Printed circuit board, chemistry.chemical_compound, chemistry, Microsystem, visual_art, 021105 building & construction, 0103 physical sciences, visual_art.visual_art_medium, Silicon carbide, Optoelectronics, Ceramic, Material properties, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::339a18f148c3d29b24c4cdd1a328d065
https://doi.org/10.1109/estc48849.2020.9229653 -
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المؤلفون: Linh Bach, Andreas Huerner, Lutz Kirste, Yi Lin Zhu, Andreas Schletz, Anton J. Bauer, Lothar Frey, Christian Giese, Tobias Erlbacher, Lucas Pinti, Christoph E. Nebel, Verena Zuerbig
المصدر: Materials Science Forum. 924:931-934
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Mechanical Engineering, Diamond, Schottky diode, 02 engineering and technology, engineering.material, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Mechanics of Materials, 0103 physical sciences, engineering, Optoelectronics, General Materials Science, 0210 nano-technology, business
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المؤلفون: Tobias Maximilian Endres, Christoph Friedrich Bayer, Daniel Dirksen, Martin Marz, Hoang Linh Bach, Sigrid Zischler, Andreas Schletz
المصدر: 2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia).
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, dBc, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Semiconductor device, 021001 nanoscience & nanotechnology, 01 natural sciences, Printed circuit board, Soldering, visual_art, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, visual_art.visual_art_medium, Optoelectronics, Embedding, Power semiconductor device, Ceramic, 0210 nano-technology, business, Electrical conductor
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::527f9d334222535e1b70af09d1b571fd
https://doi.org/10.23919/ipec.2018.8507647