المؤلفون: Cui, Zhe, Jin, Shichao, Liu, Haiyong, Gao, Feng, Shan, Nina, Fei, Chunjiao, Liu, Dunge, He, Chang, Yang, Yuqian

المصدر: 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2023 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2023

Relation: 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Liang, Weixi, Tang, Rongshan, Ji, Zhiyong, Zhao, Yubin, Liu, Dunge

المصدر: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta) SMARTWORLD-UIC-SCALCOM-DIGITALTWIN-PRICOMP-META Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta), 2022 IEEE. :2126-2133 Dec, 2022

Relation: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta)

المؤلفون: Ji, Zhiyong, Wu, Tao, Liang, Weixi, Zhao, Yubin, Liu, Dunge

المصدر: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta) SMARTWORLD-UIC-SCALCOM-DIGITALTWIN-PRICOMP-META Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta), 2022 IEEE. :2120-2125 Dec, 2022

Relation: 2022 IEEE Smartworld, Ubiquitous Intelligence & Computing, Scalable Computing & Communications, Digital Twin, Privacy Computing, Metaverse, Autonomous & Trusted Vehicles (SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta)

المؤلفون: Jin, Shichao, Liu, Dunge, Mei, Chenyu, Yang, Yuqian, Wu, Bing, Cui, Zhe

المصدر: 2022 International Symposium on Networks, Computers and Communications (ISNCC) Networks, Computers and Communications (ISNCC), 2022 International Symposium on. :1-4 Jul, 2022

Relation: 2022 International Symposium on Networks, Computers and Communications (ISNCC)

المؤلفون: Jin, Shichao, Liu, Dunge, Cui, Zhe, Mei, Chenyu, Yang, Yuqian, Wu, Bing

المصدر: 2022 International Symposium on Networks, Computers and Communications (ISNCC) Networks, Computers and Communications (ISNCC), 2022 International Symposium on. :1-4 Jul, 2022

Relation: 2022 International Symposium on Networks, Computers and Communications (ISNCC)

المؤلفون: Yuan, Ye, Zhou, Bo, Jin, Shichao, Xie, Zhuoheng, Liu, Dunge, Yang, Yuqian, Huang, Bo, Feng, Yue, Mei, Chenyu, Huang, Jun, Liu, Lipeng, Wang, Chao

المصدر: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2022 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2022

Relation: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Jin, Shichao, Mei, Chenyu, Liu, Dunge, Huang, Jun, Zhou, Bo, Fei, Chunjiao, Yang, Yuqian, Liu, Lipeng

المصدر: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2022 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2022

Relation: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Yang, Yu-Qian, Jin, Shichao, Liu, Dunge, Yang, Bo, Huang, Jun, Cheng, Yujian, Fei, Chunjiao, Zhou, Bo, Mei, Chenyu, Liu, Lipeng, Zhang, Lei

المصدر: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2022 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2022

Relation: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Jin, Shichao, Huang, Bo, Yuan, Ye, Liu, Dunge, Mei, Chenyu, Yang, Yuqian, Zhou, Bo, Xie, Zhuoheng, Liu, Lipeng, Huang, Jun, Fei, Chunjiao

المصدر: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2022 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2022

Relation: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

المؤلفون: Cui, Zhe, Zhou, Bo, Liu, Dunge, Jin, Shichao, Gao, Feng, Yang, Yuqian, Mei, Chenyu, Fei, Chunjiao, Huang, Jun, Liu, Lipeng

المصدر: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2022 IEEE MTT-S International Microwave Workshop Series on. :1-3 Nov, 2022

Relation: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)