يعرض 1 - 10 نتائج من 41 نتيجة بحث عن '"Liu, Lin-Jie"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    مؤتمر
    Research on resonance reduction method of CQFN ceramic package

    المؤلفون: Yu, Xi-Meng, Yang, Zhen-Tao, Liu, Lin-Jie

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    Study on combining technology of thin film process and multilayer alumina ceramic process

    المؤلفون: Yu, Fei, Yang, Zhen-tao, Yu, Xi-meng, Liu, Lin-jie

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    Research on the influence of parallel seam welding parameters on the reliability of thin-walled ceramic package

    المؤلفون: Yang, Zhen-tao, Chen, Jiang-tao, Liu, Lin-jie, Shi, Peng-yuan

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Research on design and processing technology of 0.4mm pitch CQFN package

    المؤلفون: Yang, Zhen-tao, Yu, Fei, Liu, Lin-jie, Gan, Zuo-teng, Li, Han

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Research on the influence of electroplating lines on the transmission performance of ceramic package

    المؤلفون: Yang, Zhen-Tao, Yi, Fei, Liu, Lin-Jie, Bi, Da-Peng

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Research on ceramic package for high temperature electronic devices

    المؤلفون: Yang, Zhen-tao, Yu, Xi-meng, Liu, Lin-jie, Wang, Dong-sheng

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Research on Signal Integrity of UWB BGA Differential Transmission Structure Based on HiTCE

    المؤلفون: Yu, Xi-meng, Yang, Zhen-tao, Liu, Lin-jie

    المصدر: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2022 International Conference on. :1-3 Aug, 2022

    Relation: 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

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  8. 8
    مؤتمر
    Research on design and fabrication of ceramic package for magnetoresistive random access memory

    المؤلفون: Zhang, Qian, Liu, Yao-Yao, Yang, Zhen-Tao, Liu, Lin-Jie

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-3 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Research on the design and processing technology of CQFJ ceramic package

    المؤلفون: Yu, Fei, Yang, Zhen-tao, Liu, Lin-jie, Gao, Ling

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Research on the board level reliability of CQFJ ceramic package

    المؤلفون: Yang, Zhen-tao, Yu, Fei, Liu, Lin-jie, Gao, Ling

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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