يعرض 1 - 10 نتائج من 5,461 نتيجة بحث عن '"Liu, Pan"', وقت الاستعلام: 1.92s تنقيح النتائج
  1. 1
    مؤتمر
    Finite Element Analysis of Planar Inductors With Soft Magnetic Encapsulation Materials

    المؤلفون: Wang, Jiaxuan, Li, Xiao, Zhao, Jiayan, Li, Jinbing, Zhang, Guoqi, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    An SEM-Based Finite Element Analysis of Cu-Ag Sintered Joints on Thermal Shock Reliability

    المؤلفون: Wang, Xinyue, Yang, Zhoudong, Ji, Liangzheng, Zeng, Zejun, Chen, Haixue, Fan, Jiajie, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    Revolutionizing Power Module Manufacturing: Large Area Sintering with Silver Pastes for Enhanced Performance and Cost-Effectiveness

    المؤلفون: Wang, Jianhao, Gao, Yue, He, Yiting, Liu, Wenting, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Non-Pressure Cu Sinter Paste for High Density Power Device Interconnection

    المؤلفون: Gao, Yue, Wang, Jianhao, He, Yiting, Liu, Wenting, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    An Investigation of Process Parameters Effects on Void Formation in Fluxless Solder Paste for Power Module Packaging Applications via Formic Acid Vacuum Reflow Technology

    المؤلفون: Ji, Liangzheng, Guo, Wenwu, Zhang, Guoqi, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging

    المؤلفون: Liu, Wenting, Wang, Jianhao, Gao, Yue, Ji, Liangzheng, Zhang, Jing, Zhang, Guoqi, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Hazard Detection for Power Transmission Channel Based on Texture Enhancement and Context Awareness

    المؤلفون: Chen, Peng, Huang, WeiLun, Lin, Bin, Liu, Pan

    المصدر: 2024 43rd Chinese Control Conference (CCC) Chinese Control Conference (CCC), 2024 43rd. :7942-7947 Jul, 2024

    Relation: 2024 43rd Chinese Control Conference (CCC)

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  8. 8
    دورية أكاديمية
    Effect of α-linolenic acid (ALA) on proliferation of probiotics and its adhesion to colonic epithelial cells

    المؤلفون: LIU, Pan, LIU, Mo, LIU, Xiaogeng, XUE, Mei, JIANG, Qian, LEI, Hong

    المصدر: Food Science and Technology. January 2022 42

    مصطلحات موضوعية: α-linolenic acid (ALA), high-fat diet, probiotics, proliferation, adhesion

    وصف الملف: text/html

    URL الوصول: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0101-20612022000100805

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  9. 9
    مؤتمر
    A modified U-Net method for pneumonia lesion segmentation based on coordinate attention mechanism

    المؤلفون: Xu, Wenrui, Qi, Guochen, Tian, Hui, Cao, Yangjie, Zhu, Mingfu, Wei, Ronghan, Liu, Pan

    المصدر: 2024 5th International Conference on Computer Vision, Image and Deep Learning (CVIDL) Computer Vision, Image and Deep Learning (CVIDL), 2024 5th International Conference on. :496-500 Apr, 2024

    Relation: 2024 5th International Conference on Computer Vision, Image and Deep Learning (CVIDL)

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  10. 10
    مؤتمر
    Process-based IGBT Modeling with TCAD for Static and Dynamic Parameters

    المؤلفون: Chang, Yifei, Qi, Lina, Luo, Runding, Liu, Pan

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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