المؤلفون: Chen, Y.J., Liu, Q.J., Wei, L., Liu, J.W., Chan, K.C.

المصدر: In Journal of Materials Research and Technology July-August 2024 31:62-72

المؤلفون: Wang, J., Yu, H., Cai, H., Du, L.P., Liu, Q.J., Wang, P.

المصدر: 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International. :2122-2125 Jun, 2011

Relation: TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

المؤلفون: Pang, J.H.L., Shi, X.Q., Zhang, X.R., Liu, Q.J.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :926-932 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Pang, J.H.L., Zhang, X.K., Liu, Q.J., Che, F.X., Low, T.H., Shi, X.Q., Wang, Z.P.

المصدر: 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :115-119 2002

Relation: Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002)

المؤلفون: Xunqing Shi, Pang, H.L.J., Zhang, X.R., Liu, Q.J., Ying, M.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 27(4):659-667 Dec, 2004

المؤلفون: Liu, Q.J., An, J., Zhang, G.H., Wu, X.Y.

المصدر: In Soil & Tillage Research July 2016 160:92-100

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المؤلفون: Zhang, J., Xu, L.J., Zhu, Z.Q., Liu, Q.J.

المصدر: In Materials Research Bulletin October 2015 70:358-364

المؤلفون: Liu, Q.J., An, J., Wang, L.Z., Wu, Y.Z., Zhang, H.Y.

المصدر: In Soil & Tillage Research April 2015 147:50-59

المؤلفون: Liu, Q.J., Zhang, H.Y., An, J., Wu, Y.Z.

المصدر: In Catena April 2014 115:11-18