يعرض 1 - 10 نتائج من 407 نتيجة بحث عن '"Liu, Yan Cheng"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    The Development of 1.7kV 100A SiC MOSFET Power Module for Automotive Application

    المؤلفون: Chiu, Po-Kai, Lin, Hsin-Han, Huan, Yuan-Cheng, Syu, Ji-Yuan, Liu, Yan-Cheng, Fan, Yan-Bo, Cheng, Yu-Hua, Chang, Chien-Wei, Hsieh, Yung-Min, Kao, Kuo-Shu, Tsai, Chu-Han

    المصدر: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2023 IEEE Workshop on. :1-4 Aug, 2023

    Relation: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

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  2. 2
    مؤتمر
    Solder Joint Lifetime Characterization of a SiC Power MOSFET Module Under Power Cycling

    المؤلفون: Wang, He-Hong, Cheng, Hsien-Chie, Liu, Yan-Cheng, Syu, Ji-Yuan, Kao, Kuo-Shu, Chang, Tao-Chih

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Identification of Common Mode Noise Current Path in a SiC Power Module

    المؤلفون: Tzeng, Chih-Ming, Chiu, Pin-Tzu, Pong, M.H., Liu, Yan-Cheng, Yao, Chun-Jen, Lin, Hsin-Han, Cheng, Yu-Hua, Chiu, Huang-Jen

    المصدر: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia) Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia), 2023 11th International Conference on. :255-259 May, 2023

    Relation: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia)

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  4. 4
    مؤتمر
    Estimation of Switching Transients and Power Losses of SiC-based Power MOSFET Inverter Using Electromagnetic-circuit Co-simulation during Six-step Commutation

    المؤلفون: Liu, Yan-Cheng, Cheng, Hsien-Chie, Lin, Hsin-Han, Chiou, Shian-Chiau, Wu, Sheng-Tai, Chang, Tao-Chih

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :159-160 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  5. 5
    دورية أكاديمية
    An efficient localized Trefftz method for the simulation of two-dimensional sloshing behaviors

    المؤلفون: Lin, Xiran, Xu, Liangbin, Liu, Yan-Cheng, Fan, C.M.

    المصدر: In Ocean Engineering 1 May 2024 299

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  6. 6
    دورية أكاديمية
    Mass Spectrum and Theoretical Calculation for Azide Radical Complexes With Uranyl(Ⅴ) Cation ［UO2(N3)n］+(n=1-4)

    المؤلفون: HONG Jing, HAN Chang-cai, FEI Ze-jie, TANG Yuan-yuan, LIU Yan-cheng, ZHOU Lu-lu, LIU Hong-tao, XIONG Xiao-gen, DONG Chang-wu

    المصدر: He huaxue yu fangshe huaxue, Vol 45, Iss 5, Pp 466-476 (2023)

    مصطلحات موضوعية: actinide coordination chemistry, uranyl complexes, computational chemistry, azide radical complexes, Nuclear engineering. Atomic power, TK9001-9401, Chemical technology, TP1-1185

    وصف الملف: electronic resource

    Relation: http://www.jnrc.org.cn/CN/10.7538/hhx.2023.45.05.0466; https://doaj.org/toc/0253-9950

    URL الوصول: https://doaj.org/article/74be6ae2f661430d8084a1de4e5a7cf1

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  7. 7
    دورية أكاديمية
    Synthesis, crystal structure, DNA binding, and anticancer activity of the cobalt(II), nickel(II), and copper(II) complexes of 9-benzothiazolanthrahydrazone

    المؤلفون: Wu, Ying-shu, Ding, Tong-yan, Zeng, Yu-ting, Liu, Rui-xue, Liu, Yan-cheng, Liang, Hong

    المصدر: In Journal of Molecular Structure 5 March 2024 1299

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  8. 8
    مؤتمر
    Fixed-Time Sliding-Mode Reaching Based Trajectory Tracking Control of Unmanned Underwater Vehicles

    المؤلفون: Ma, Chuan, Liu, Yan Cheng

    المصدر: 2018 3rd International Conference on Mechanical, Control and Computer Engineering (ICMCCE) ICMCCE Mechanical, Control and Computer Engineering (ICMCCE), 2018 3rd International Conference on. :316-321 Sep, 2018

    Relation: 2018 3rd International Conference on Mechanical, Control and Computer Engineering (ICMCCE)

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  9. 9
    مؤتمر
    A Study of Factors Affecting Process-Induced Warpage Behavior of Flip Chip Package on Package

    المؤلفون: Chen, Yi-Huang, Tai, Ling-Ching, Liu, Yan-Cheng, Cheng, Hsien-Chie

    المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :105-106 May, 2021

    Relation: 2021 International Conference on Electronics Packaging (ICEP)

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  10. 10
    دورية أكاديمية
    A Modified Virtual Generator Control for DC Microgrid with Improved Dynamic Characteristics of DC Bus Voltage and Enhanced current Sharing Effect

    المؤلفون: Zhang, Han-WenAff1, IDs4283502201109z_cor1, Zhang, Qin-Jin, Liu, Yan-Cheng, Wang, Hong-Lai, Hu, Wang-Bao

    المصدر: Journal of Electrical Engineering & Technology. 17(6):3445-3456

    Find this article in full text from Springer Verlag.
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