المؤلفون: Wu Yuanyuan, Luo Liangzhi, Hao Ziyang, Liu Dongsheng

المصدر: Medical Review, Vol 4, Iss 3, Pp 207-224 (2024)

مصطلحات موضوعية: dna origami, frame guided assembly (fga), dna hydrogel, rna delivery, gene therapy, dna-based nanostructures, Medicine

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2749-9642

URL الوصول: https://doaj.org/article/ac6b819166ca4163809acf1d149d6a95

المؤلفون: Lu, Jiahao, Zhang, Jiaming, Luo, Zhixiang, Li, Aobo, Huang, Tianze, Liu, Dongsheng, Cheng, Chi

المصدر: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2024 IEEE 67th International Midwest Symposium on. :29-32 Aug, 2024

Relation: 2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Yang Lingyun, Liu Dongsheng, Wüthrich Kurt

المصدر: Acta Biochimica et Biophysica Sinica, Vol 54, Pp 1207-1212 (2022)

مصطلحات موضوعية: G protein-coupled receptor dynamics, stable-isotope labeling, fluorine-19 NMR, GPCR biology, drug development, Biochemistry, QD415-436, Genetics, QH426-470

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1672-9145

URL الوصول: https://doaj.org/article/f43a37df32454a458f60e4229eb6acb6

المؤلفون: Huang, Tianze, Lu, Jiahao, Liu, Dongsheng, Li, Aobo, Yang, Shuo, Chen, Lei, Li, Xiang

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Chen, Zhitong, Liu, Dongsheng, Wang, Hexing

المصدر: 2024 IEEE 3rd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA) Electrical Engineering, Big Data and Algorithms (EEBDA), 2024 IEEE 3rd International Conference on. :476-481 Feb, 2024

Relation: 2024 IEEE 3rd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA)

المؤلفون: Li, Aobo, Lu, Jiahao, Liu, Dongsheng, Li, Xiang, Yang, Shuo, Zhang, Jiaming, Huang, Tianze, Xiong, Siqi

المصدر: 2023 IEEE 16th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC) MCSOC Embedded Multicore/Many-core Systems-on-Chip (MCSoC), 2023 IEEE 16th International Symposium on. :1-8 Dec, 2023

Relation: 2023 IEEE 16th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC)

المؤلفون: Wang, He, Chen, Li, Yin, Yao, Liu, Dongsheng, Shen, Jian

المصدر: 2023 International Conference on Intelligent Communication and Networking (ICN) Intelligent Communication and Networking (ICN), 2023 International Conference on. :87-90 Nov, 2023

Relation: 2023 International Conference on Intelligent Communication and Networking (ICN)

المؤلفون: Cao, Zhiyuan, Zhang, ChengCheng, Jin, Zirui, Liu, Dongsheng

المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

المؤلفون: Li, Aobo, Lu, Jiahao, Liu, Dongsheng, Li, Xiang

المصدر: 2024 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2024 IEEE. :1-2 Apr, 2024

Relation: 2024 IEEE Custom Integrated Circuits Conference (CICC)

المؤلفون: Li., Aobo, Lu, Jiahao, Liu, Dongsheng, Hu, Ang, Li, Xiang, Yang, Shuo, Huang, Tianze

المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :694-697 Aug, 2023

Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)