المؤلفون: Yujun Wang, Jianglai Tian, Bo Wang, Lixi Wan, Zhi Jin

المصدر: Micromachines, Vol 14, Iss 11, p 2069 (2023)

مصطلحات موضوعية: Marchand balun, impedance, broadband, mixer, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/11/2069; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/6686c57176354d5ebbf5628a262d8e44

المؤلفون: Yujun Wang, Yi Wang, Lixi Wan, Zhi Jin

المصدر: Micromachines, Vol 14, Iss 2, p 356 (2023)

مصطلحات موضوعية: PGA, class AB, pre-charge, linearity, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/2/356; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/ad6ea01088b44dd5999301e848eea432

المؤلفون: Fengman Liu, Lixi Wan, Jing Zhou, Baoxia Li, Tianmin Du, Wei Gao, Fei Wan

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :153-157 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Fengwei Dai, Daquan Yu, Wen Yin, Ning Zhao, Lixi Wan, Han Yu, Su Wang, Jiangyan Sun

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :175-179 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Jing Zhou, Daquan Yu, Ran He, Feng WeiDai, Xueping Guo, Chongshen Song, HuiJuan Wang, Guidotti, Daniel, Liqiang Cao, Lixi Wan

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :686-690 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Qidong, Wang, Liqiang, Cao, Jun, Li, Jin, Zhang, Daniel, Guidotti, Lixi, Wan

المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-5 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Kun, Yang, Wei, Gao, Zhihua, Li, Lixi, Wan

المصدر: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Huijuan Wang, Fengwei Dai, Guidotti, Daniel, Yao Lv, Liqiang Cao, Lixi Wan

المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :843-846 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Baoxia Li, Wei Gao, Fengman Liu, Haifei Xiang, Jing Zhou, Jun Li, Zhihua Li, Jian Song, Lixi Wan

المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :834-838 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Yunyan Zhou, Lixi Wan, Liqiang Cao

المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :503-507 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)