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1دورية أكاديمية
المؤلفون: Lyu, Y., Kang, H.J., Widyasari, R., Lawall, J., Lo, D.
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(9):2219-2239 Sep, 2024
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2دورية أكاديمية
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(6):1360-1373 Jun, 2024
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3دورية أكاديمية
المؤلفون: Yang, Z., Xu, B., Zhang, J.M., Kang, H.J., Shi, J., He, J., Lo, D.
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(4):721-741 Apr, 2024
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4دورية أكاديمية
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(3):461-473 Mar, 2024
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5دورية أكاديمية
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(3):443-460 Mar, 2024
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6دورية أكاديمية
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 50(2):296-321 Feb, 2024
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7دورية أكاديمية
المؤلفون: Gohil, V., Dev, S., Upasani, G., Lo, D., Ranganathan, P., Delimitrou, C.
المصدر: IEEE Computer Architecture Letters IEEE Comput. Arch. Lett. Computer Architecture Letters. 23(1):95-98 Jan, 2024
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8مؤتمر
المصدر: 2023 38th IEEE/ACM International Conference on Automated Software Engineering (ASE) ASE Automated Software Engineering (ASE), 2023 38th IEEE/ACM International Conference on. :40-52 Sep, 2023
Relation: 2023 38th IEEE/ACM International Conference on Automated Software Engineering (ASE)
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9دورية أكاديمية
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 49(10):4691-4706 Oct, 2023
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10دورية أكاديمية
المؤلفون: Nguyen, T.G., Le-Cong, T., Kang, H.J., Widyasari, R., Yang, C., Zhao, Z., Xu, B., Zhou, J., Xia, X., Hassan, A.E., Le, X.D., Lo, D.
المصدر: IEEE Transactions on Software Engineering IIEEE Trans. Software Eng. Software Engineering, IEEE Transactions on. 49(8):4035-4057 Aug, 2023