المؤلفون: Ji, Jiao-Dong, Li, Yung-Ta, Liao, Shin-Hao, Liao, Chiu-Chen, Lo, Yu-Min, Huang, Hsiang-Hua, Yu, Kuo-Haw, Lin, Chang-Fu, Chung, Key

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :256-258 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Ji, Jiao-Dong, Liao, Chia-Te, Liao, Chiu-Chen, Lo, Yu-Min, Liu, I-Tang, Huang, Hsiang-Hua, Yu, Kuo-Haw, Lin, Chang-Fu, Chung, Key, Hsiao, C.S

المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :275-277 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chiu-Chen Liao, Lo Yu-Min, Yung-Ta Li, Lin Chang-Fu, Shin-Hao Liao, Kuo-Haw Yu, Hsiang-Hua Huang, Key Chung, Jiao-Dong Ji

المصدر: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: Materials science, 010102 general mathematics, Delamination, Flux, Chip, 01 natural sciences, 010101 applied mathematics, Substrate (building), Soldering, Wetting, 0101 mathematics, Composite material, Electrical conductor, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7c31fe70509502e47ad7da9b79ea0043
https://doi.org/10.1109/impact.2018.8625811

المؤلفون: Chiu-Chen Liao, Hsiang-Hua Huang, Key Chung, Lin Chang-Fu, Jiao-Dong Ji, Kuo-Haw Yu, I-Tang Liu, C.S. Hsiao, Chia-Te Liao, Lo Yu-Min

المصدر: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

مصطلحات موضوعية: Materials science, Soldering, Package on package, Hardware_INTEGRATEDCIRCUITS, Stacking, Interposer, Mechanical engineering, Substrate (printing), Thermocompression bonding, Electrical efficiency, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0333eba6749a83f965e1a3dfd943f779
https://doi.org/10.1109/impact.2017.8255921