يعرض 1 - 10 نتائج من 747 نتيجة بحث عن '"Load-to-failure"', وقت الاستعلام: 0.99s تنقيح النتائج
  1. 1
    مؤتمر
    Switch process analysis for supply restoration using a novel hybrid soft open point

    المؤلفون: Xiong, Liying, Lai, Zhenhong, Zhuang, Haoyan, Yi, Hao, Wang, Zhenxiong, Yang, Zebin

    المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :1089-1093 May, 2024

    Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

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  2. 2
    دورية أكاديمية
    Assessment of formalin preserved and fresh frozen quadriceps tendon graft-suture constructs for load to failure testing: a biomechanical cadaveric study

    المؤلفون: Malik, Shahbaz S., Hart, DarrenAff2, IDs0059002403976w_cor2, Gustafson, Sara, Peeler, Jason, McRae, Sheila, MacDonald, Peter

    المصدر: European Journal of Orthopaedic Surgery & Traumatology. :1-7

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  3. 3
    مؤتمر
    Process Recipes of Additively Printed Sustainable Silver-Ink Using Aerosol Jet Printing

    المؤلفون: Lall, Pradeep, Bimali, Sabina, Soni, Ved, Miller, Scott

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  4. 4
    مؤتمر
    Process Recipes and Performance of Printable Formable inks for In-Mold Electronics Applications

    المؤلفون: Lall, Pradeep, Naranagaparambil, Jinesh, Miller, Scott

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  5. 5
    مؤتمر
    An Optimalized Power System Stability Control Structure Based on Breaker Failure Protection as Backup

    المؤلفون: Dang, Yiqi, Wang, Hua, Liu, Lei, Chen, Wenzhe, Xu, Hongxiang, Han, Wei, Ma, Weidong

    المصدر: 2022 12th International Conference on Power and Energy Systems (ICPES) Power and Energy Systems (ICPES), 2022 12th International Conference on. :190-197 Dec, 2022

    Relation: 2022 12th International Conference on Power and Energy Systems (ICPES)

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  6. 6
    مؤتمر
    Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  7. 7
    مؤتمر
    Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  8. 8
    مؤتمر
    Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-12 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  9. 9
    مؤتمر
    Interaction of Photonic Curing Process Parameters on Additively Printed Copper Circuits

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Hill, Curtis

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  10. 10
    مؤتمر
    Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications

    المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1172-1183 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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