يعرض 1 - 8 نتائج من 8 نتيجة بحث عن '"Lobbicke, Kai"', وقت الاستعلام: 0.82s تنقيح النتائج
  1. 1
    مؤتمر
    Reliability Investigations of Additive Manufactured RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology

    المؤلفون: Schmalzbauer, Michael, Jakob, Johannes, Rohrl, Franz X., Sepaintner, Felix, Scharl, Andreas, Lobbicke, Kai, Bogner, Werner, Zorn, Stefan

    المصدر: 2021 51st European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2021 51st. :330-333 Apr, 2022

    Relation: 2021 51st European Microwave Conference (EuMC)

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  2. 2
    مؤتمر
    On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach

    المؤلفون: Ndip, Ivan, Lobbicke, Kai, Tschoban, Christian, Ranzinger, Christian, Richlowski, Karim, Contag, Andreas, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

    المصدر: 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on. :491-495 Aug, 2014

    Relation: 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014

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  3. 3
    مؤتمر
    Analysis and comparison of methods for extracting the inductance and capacitance of TSVs

    المؤلفون: Ndip, Ivan, Lobbicke, Kai, Zoschke, Kai, Guttowski, Stephan, Wolf, Jurgen, Reichl, Herbert, Lang, Klaus-Dieter

    المصدر: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :407-411 Dec, 2012

    Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

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  4. 4
    مؤتمر
    Modeling the impact of return-path discontinuity on interconnects for Gb/s applications

    المؤلفون: Ndip, Ivan, Lobbicke, Kai, Tschoban, Christian, Topper, Michael, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter

    المصدر: 2010 IEEE International Symposium on Electromagnetic Compatibility Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on. :579-584 Jul, 2010

    Relation: 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010

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  5. 5
    مؤتمر
    Equivalent circuit modeling of signal vias considering their return current paths

    المؤلفون: Ndip, Ivan, Ohnimus, Florian, Lobbicke, Kai, Tschoban, Christian, Bierwirth, Micha, Guttowski, Stephan, Reichl, Herbert

    المصدر: 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on. :629-632 Apr, 2010

    Relation: 2010 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)

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  6. 6
    دورية أكاديمية
    Characterization of Additively Produced RF-Structures on Low-Cost PCB Materials Based on Inkjet Technology for Industrial Applications up to 80 GHz.

    المؤلفون: Sepaintner, Felix, Schmalzbauer, Michael, Lobbicke, Kai, Jakob, Johannes, Scharl, Andreas, Rohrl, Franz, Sammer, Roman, Bogner, Werner, Zorn, Stefan

    المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Dec2021, Vol. 11 Issue 12, p2077-2088, 12p

    مصطلحات موضوعية: PRINTED circuits industry, SURFACE roughness, CABLES, PRINTED circuits, INDUSTRIAL applications, SURFACE impedance, RADIO frequency

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  7. 7
    دورية أكاديمية
    Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs).

    المؤلفون: Ndip, Ivan, Zoschke, Kai, Lobbicke, Kai, Wolf, M. Jurgen, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

    المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2014, Vol. 4 Issue 3, p504-515, 12p

    مصطلحات موضوعية: ELECTRIC inductance, THROUGH-silicon via, ELECTROMAGNETIC fields, ELECTRIC capacity, STATISTICAL correlation, ELECTRIC fields

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  8. 8
    دورية أكاديمية
    High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes.

    المؤلفون: Ndip, Ivan, Curran, Brian, Lobbicke, Kai, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

    المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Oct2011, Vol. 1 Issue 10, p1627-1641, 15p

    مصطلحات موضوعية: RADIO frequency, SILICON, INTEGRATED circuits, SKIN effect, DIELECTRICS, TRANSMISSION electron microscopy, ELECTRIC resistance, ELECTRIC lines, ELECTROMAGNETIC fields

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