المؤلفون: Paparsenos, Evangelos, Tsiatouhas, Yiorgos

المصدر: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET) Electronics & Telecommunications (PACET), 2024 Panhellenic Conference on. :1-6 Mar, 2024

Relation: 2024 Panhellenic Conference on Electronics & Telecommunications (PACET)

المؤلفون: Ghosh, Bitan, Batabyal, Debojyoti, Biswas, Priyanka, Halder, Niladri, Roy, Dibyendu, Sarkar, Partha Pratim^{Aff1, IDs12596023012373_cor6}, Ghoshal, Ardhendu

المصدر: Journal of Optics. 53(1):610-621

المؤلفون: Farheen, T., Roy, S., Tajik, S., Forte, D.

المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 31(1):65-78 Jan, 2023

المؤلفون: Huening, Jennifer, Joshi, Prasoon, Zhao, Shuai, Chuang, Wen-hsien, Tong, Tom, Ma, Zhiyong

المصدر: 2021 IEEE Physical Assurance and Inspection of Electronics (PAINE) Physical Assurance and Inspection of Electronics (PAINE), 2021 IEEE. :1-6 Nov, 2021

Relation: 2021 IEEE Physical Assurance and Inspection of Electronics (PAINE)

المؤلفون: Chowdhury, Subhajit Dutta, Yang, Kaixin, Nuzzo, Pierluigi

المصدر: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2021 IEEE/ACM International Conference On. :1-9 Nov, 2021

Relation: 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)

المؤلفون: Li, J., Zhang, G., Liu, C., Zhang, W.

المصدر: IEEE Transactions on Fuzzy Systems IEEE Trans. Fuzzy Syst. Fuzzy Systems, IEEE Transactions on. 29(12):3822-3832 Dec, 2021

المؤلفون: Zanotti, T., Puglisi, F.M., Pavan, P.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(2):183-191 Jun, 2021

المؤلفون: Boit, Christian, Kiyan, Tuba, Krachenfels, Thilo, Seifert, Jean-Pierre

المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-7 Jul, 2020

Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Tigelaar, Howard^Aff2

المساهمون: Tigelaar, Howard^Aff1

المصدر: How Transistor Area Shrank by 1 Million Fold. :21-50

المؤلفون: Ghosh, Bitan^Aff1, Hazra, Smita, Sarkar, Partha Pratim^Aff1

المصدر: Journal of Optics. 48(3):365-374