المؤلفون: Beena, Nithin Anujan, Lorenz, Lukas, Ludewig, Thomas, Swiecinski, Kai, Bock, Volker

المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-9 May, 2024

Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Lorenz, Lukas, Ludewig, Thomas, Swiecinski, Kai, Ollmann, Henrik, Razkordanisharahi, Amirabbas, Bock, Volker

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Weyers, David, Nieweglowski, Krzysztof, Lorenz, Lukas, Bock, Karlheinz

المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2021 23rd European. :1-7 Sep, 2021

Relation: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Lorenz, Lukas, Hanesch, Florian, Nieweglowski, Krzysztof, Hamjah, Mohd-Khairulamzari, Franke, Jorg, Hoffmann, Gerd-Albert, Overmeyer, Ludger, Bock, Karlheinz

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :14-21 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Hamjah, Mohd-Khairulamzari, Zeitler, Jochen, Eiche, Yannic, Lorenz, Lukas, Backhaus, Carsten, Hoffmann, Gerd-Albert, Wienke, Alexander, Kaierle, Stefan, Overmeyer, Ludger, Lindlein, Norbert, Bock, Karlheinz, Franke, Joerg

المصدر: 2021 14th International Congress Molded Interconnect Devices (MID) Molded Interconnect Devices (MID), 2021 14th International Congress. :1-11 Feb, 2021

Relation: 2021 14th International Congress Molded Interconnect Devices (MID)

المؤلفون: Lorenz, Lukas, Ott, Lennard, Nieweglowski, Krzysztof, Bock, Karlheinz

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020

Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Lorenz, Lukas, Hanesch, Florian, Nieweglowski, Krzysztof, Eiche, Yannic, Franke, Jorg, Hoffmann, Gerd-Albert, Overmeyer, Ludger, Bock, Karlheinz

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-6 Sep, 2020

Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Nieweglowski, Krzysztof, Lorenz, Lukas, Bock, Karlheinz, Catuneanu, Mircea, Jamshidi, Kambiz

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :139-147 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ackstaller, Thomas, Lorenz, Lukas, Nieweglowski, Krzysztof, Bock, Karlheinz

المصدر: 2019 42nd International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2019 42nd International Spring Seminar on. :1-6 May, 2019

Relation: 2019 42nd International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Lorenz, Lukas, Nieweglowski, Krzysztof, Wolter, Klaus-Jurgen, Bock, Karlheinz

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-6 Sep, 2018

Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)