المؤلفون: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Chong, D.Y.R., Ng, K., Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :210-217 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Pang, J.H.L., Low, P.T.H., Xiong, B.S.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:131-136 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Chong, D.Y.R., Toh, H.J., Lim, B.K., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Luhua Xu

المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 1:8 pp. 2005

Relation: Proceedings of 7th Electronics Packaging Technology Conference

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تسجيل الدخول للوصول الكامل.