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1مؤتمر
المؤلفون: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.
المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005
Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference
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2مؤتمر
المؤلفون: Chong, D.Y.R., Ng, K., Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X.
المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :210-217 2004
Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
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3مؤتمر
المؤلفون: Pang, J.H.L., Low, P.T.H., Xiong, B.S.
المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:131-136 Vol.2 2004
Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems
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4مؤتمر
المؤلفون: Chong, D.Y.R., Toh, H.J., Lim, B.K., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Luhua Xu
المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 1:8 pp. 2005
Relation: Proceedings of 7th Electronics Packaging Technology Conference
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5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
6مؤتمر
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.