يعرض 1 - 10 نتائج من 191 نتيجة بحث عن '"Low temperature solder"', وقت الاستعلام: 0.79s تنقيح النتائج
  1. 1
    مؤتمر
    Sustainable temperature and pressure sensor for tire

    المؤلفون: Keranen, Kimmo, Kurkela, Timo, Ollila, Jyrki, Korkalainen, Marko, Tanskanen, Antti, Balin, Antoine, Buchholz, Arne, Mani, Anbarasan

    المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

    Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

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  2. 2
    مؤتمر
    Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution

    المؤلفون: Teng, Saw Lip, Devarajan, Mutharasu, Nadarajah, Puurnaraj A-L, Yang Soo, Chye

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration

    المؤلفون: Chakraborty, Souvik, Chen, Yaxiong, Sharma, Gaurav, Fahim, Abdullah, Hauck, Torsten, Das, Ronit, Mahmood, Atif, Suhling, Jeffrey C., Borgesen, Peter

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :506-513 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Overcoming Assembly Process Challenges in Glass Interposer: Development of Jigs and Fixtures

    المؤلفون: Ubed, Mohammed, Ramana, Pamidigantam, Veerandi, Anusha, Kumar Yeluripati, Rohin, G, VenuGopal

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :165-168 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

    المؤلفون: Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Nogita, Kazuhiro

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :207-208 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  6. 6
    مؤتمر
    A Thermodynamic Modeling Approach for the Design and Development of Low-Temperature Solder Alloys

    المؤلفون: Chen, Y. C., Chang, F. L., Chuang, M. C., Su, Y. C., Kao, C. R.

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :205-206 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  7. 7
    مؤتمر
    Investigation of Additional Elements in Sn-Bi Based Low-Temperature Solder

    المؤلفون: Chang, F. L., Chen, Y. C., Lin, Y. H., Wu, P. K., Chuang, M. C., Kao, C. R.

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :203-204 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  8. 8
    دورية أكاديمية
    In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints

    المؤلفون: Jois, Chetan, Chou, Pei-En, Subbarayan, GaneshAff1, IDs11664024110437_cor3

    المصدر: Journal of Electronic Materials. 53(6):3070-3077

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  9. 9
    مؤتمر
    Test device design and test procedure for non-destructive characterization of Bi phase accumulation during electromigration

    المؤلفون: Jois, Chetan, Chou, Pei-En, Prasad, Sudarshan Prasanna, Handwerker, Carol, Subbarayan, Ganesh

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-5 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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  10. 10
    مؤتمر
    Reliability of BGAs and Mixed Low Temperature Solder Assemblies

    المؤلفون: Ghaffarian, Reza, Meilunas, Michael

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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