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1مؤتمر
المؤلفون: Keranen, Kimmo, Kurkela, Timo, Ollila, Jyrki, Korkalainen, Marko, Tanskanen, Antti, Balin, Antoine, Buchholz, Arne, Mani, Anbarasan
المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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2مؤتمر
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المؤلفون: Chakraborty, Souvik, Chen, Yaxiong, Sharma, Gaurav, Fahim, Abdullah, Hauck, Torsten, Das, Ronit, Mahmood, Atif, Suhling, Jeffrey C., Borgesen, Peter
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :506-513 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Ubed, Mohammed, Ramana, Pamidigantam, Veerandi, Anusha, Kumar Yeluripati, Rohin, G, VenuGopal
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :165-168 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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5مؤتمر
المؤلفون: Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Nogita, Kazuhiro
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :207-208 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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6مؤتمر
المؤلفون: Chen, Y. C., Chang, F. L., Chuang, M. C., Su, Y. C., Kao, C. R.
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :205-206 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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7مؤتمر
المؤلفون: Chang, F. L., Chen, Y. C., Lin, Y. H., Wu, P. K., Chuang, M. C., Kao, C. R.
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :203-204 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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8دورية أكاديمية
المؤلفون: Jois, Chetan, Chou, Pei-En, Subbarayan, GaneshAff1, IDs11664024110437_cor3
المصدر: Journal of Electronic Materials. 53(6):3070-3077
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9مؤتمر
المؤلفون: Jois, Chetan, Chou, Pei-En, Prasad, Sudarshan Prasanna, Handwerker, Carol, Subbarayan, Ganesh
المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-5 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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10مؤتمر
المؤلفون: Ghaffarian, Reza, Meilunas, Michael
المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)