يعرض 1 - 10 نتائج من 613 نتيجة بحث عن '"Lu, Guo-Quan"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    مؤتمر
    Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module With Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating

    المؤلفون: Zhang, Zichen, Nicholas, Carl, Ngo, Khai D.T., Lu, Guo-Quan

    المصدر: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :1622-1626 Mar, 2023

    Relation: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Packaging of a 15-kV Silicon Carbide MOSFET With Insulation Enhanced by a Nonlinear Resistive Polymer-Nanoparticle Coating

    المؤلفون: Zhang, Zichen, Lu, Shengchang, Nicholas, Carl, Yun, Nick, Sung, Woongje, Ngo, Khai D.T., Lu, Guo-Quan

    المصدر: 2022 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2022 IEEE. :1-4 Oct, 2022

    Relation: 2022 IEEE Energy Conversion Congress and Exposition (ECCE)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Field-Grading Effect of a Nonlinear Resistive Polymer-Nanoparticle Composite Triple-Point Coating on Direct-Bond Copper Substrates for Packaging Medium-Voltage Power Devices

    المؤلفون: Zhang, Zichen, Yuchi, Qingrui, Boshkovski, Filip, Ngo, Khai D.T., Lu, Guo-Quan

    المصدر: 2022 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2022 IEEE. :439-442 Jun, 2022

    Relation: 2022 IEEE Electrical Insulation Conference (EIC)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating

    المؤلفون: Zhang, Zichen, Nicholas, Carl, Emmanuel, Arriola, Ngo, Khai D.T., Lu, Guo-Quan, Lynch, Justin, Yun, Nick, Morgan, Adam, Sung, Woongje

    المصدر: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) Power Electronics and Applications (EPE'23 ECCE Europe), 2023 25th European Conference on. :P.1-P.6 Sep, 2023

    Relation: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

    المؤلفون: Zhang, Zichen, Zhang, Jiaxiang, Xu, Jiayu, Ngo, Khai D.T., Lu, Guo-Quan, Cousineau, Emily, Paret, Paul, Narumanchi, Sreekant

    المصدر: 2021 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2021 IEEE. :1-7 Aug, 2021

    Relation: 2021 IEEE Electric Ship Technologies Symposium (ESTS)

    أضف إلى المفضلة
  6. 6
    مؤتمر
    Thermal and Mechanical Design of a High-Voltage Power Electronics Package

    المؤلفون: Paret, Paul, Cousineau, J. Emily, Narumanchi, Sreekant, Lu, Guo-Quan, Ngo, Khai

    المصدر: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2021 IEEE. :50-54 Jun, 2021

    Relation: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    دورية أكاديمية
    Desired Properties of a Nonlinear Resistive Coating for Shielding Triple Point in a Medium-Voltage Power Module

    المؤلفون: Xu, Jiayu, Zhang, Zichen, Ngo, Khai D. T., Lu, Guo-Quan

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 28(5):1721-1728 Oct, 2021

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    How to pressureless sinter-bond power chips with bare copper substrates using nanosilver paste?

    المؤلفون: Chen, Yue, Mei, Yunhui., Feng, Zhihong, Lu, Panpan, Wang, Meiyu, Yang, Yingkun, Lu, Guo-Quan

    المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

    Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

    أضف إلى المفضلة
  9. 9
    مؤتمر
    Die-attach on Copper by Pressureless Silver Sintering in Formic Acid

    المؤلفون: Wang, Meiyu, Xie, Yijing, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

    المصدر: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2019 31st International Symposium on. :499-502 May, 2019

    Relation: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    مؤتمر
    Processing and Characterization of Die-attach on Uncoated Copper by Pressure-less Silver Sintering and Low-pressure-assisted Copper Sintering

    المؤلفون: Wang, Meiyu, Shan, Yanliang, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

    المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :1-4 Apr, 2019

    Relation: 2019 International Conference on Electronics Packaging (ICEP)

    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء