يعرض 1 - 10 نتائج من 157 نتيجة بحث عن '"Lucat, C."', وقت الاستعلام: 1.70s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المؤلفون: Lakhmi, R., Debeda, H., Dufour, I., Lucat, C.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 10(6):1133-1137 Jun, 2010

  2. 2
    مؤتمر

    المصدر: 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International. :428-439 1990

    Relation: 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 16(5):505-510 Aug, 1993

  4. 4
    مؤتمر

    المصدر: IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203) Integrated power packaging Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on. :44-45 1998

    Relation: IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging

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  9. 9
    دورية أكاديمية

    المؤلفون: Ménil, F., Lucat, C., Debéda, H.

    المصدر: Microelectronics International: An International Journal, 1995, Vol. 12, Issue 1, pp. 13-18.

  10. 10

    المساهمون: Laboratoire de l'intégration, du matériau au système (IMS), Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Bordeaux-Université Sciences et Technologies - Bordeaux 1, Institut de Chimie de la Matière Condensée de Bordeaux (ICMCB), Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Bordeaux-Université de Bordeaux (UB), IMAPS, ANR-10-BLAN-0820,AMOS,Matériaux avancés pour capteurs optiques.(2010)

    المصدر: No. CICMT
    CICMT (International Conference & Exhibition on Ceramic Interconnect & Ceramic Microsystems Technologies)
    CICMT (International Conference & Exhibition on Ceramic Interconnect & Ceramic Microsystems Technologies), IMAPS, Apr 2015, Dresden, Germany. pp. 000224-000229
    Scopus-Elsevier