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1دورية أكاديمية
المؤلفون: Lui, B., Khusid, E., Tangel, V.E., Jiang, S.Y., Abramovitz, S.E., Oxford, C.M., White, R.S.
المصدر: In International Journal of Obstetric Anesthesia August 2024 59
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2دورية أكاديمية
المؤلفون: Chaturvedi, R., Lui, B., Tangel, V.E., Abramovitz, S.E., Pryor, K.O., Lim, K.G., White, R.S.
المصدر: In International Journal of Obstetric Anesthesia November 2023 56
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3دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
4دورية أكاديمية
المؤلفون: Lui, B., Burey, L., Ma, X., Kjaer, K., Abramovitz, S.E., White, R.S.
المصدر: In International Journal of Obstetric Anesthesia February 2021 45:74-82
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5مؤتمر
المؤلفون: Flora Ho, Hung, V., Tong, E., Choi, T., Chow, A., Wong, E., Lui, B., Kin Yau, Egnisaban, G., Mangente, T., Ng, S., Ng, A., Sing Cheng, Cheung, E., Wipiejewski, T.
المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :1032-1038 2005
Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference
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6مؤتمر
المؤلفون: Ho, F., Lui, B., Wai Hung, Fu-Wa Tong, Choi, T., Shu-Kin Yau, Egnisaban, G., Mangenete, T., Ng, A., Cheung, E., Sing Cheng, Wipiejewski, T.
المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :759-763 2004
Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
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7دورية
المؤلفون: Delda, Ray Noel M., del Rosario, Renz Lui B., Tuazon, Brian Jumaquio, Robles, Gerald S., Villablanca, Madelene Velasco, Espino, Michaela T., Dizon, John Ryan C.
المصدر: Materials Science Forum; March 2024, Vol. 1118 Issue: 1 p93-98, 6p
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8تقرير
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9دورية أكاديمية
المصدر: In Research and Practice in Thrombosis and Haemostasis October 2023 7 Supplement 2
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10
المؤلفون: Gerald Sanqui Robles, Ray Noel M. Delda, Renz Lui B. Del Rosario, Michaela T. Espino, John Ryan C. Dizon
المصدر: Key Engineering Materials. 913:17-25
مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Materials Science
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5cf3fd30ecb4fca18575d7fdbf440c0b
https://doi.org/10.4028/p-nxviqm