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1دورية أكاديمية
المؤلفون: Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C.R. Kao
المصدر: Journal of Materials Research and Technology, Vol 15, Iss , Pp 4541-4553 (2021)
مصطلحات موضوعية: Interconnection, Die attachment, Micro-Ag sintering, Ag–In intermetallic compounds, Transient liquid phase bonding, Mechanical properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Praewpilin Kangvansura, Ly May Chew, Chanapa Kongmark, Phatchada Santawaja, Holger Ruland, Wei Xia, Hans Schulz, Attera Worayingyong, Martin Muhler
المصدر: Engineering, Vol 3, Iss 3, Pp 385-392 (2017)
مصطلحات موضوعية: CO2 hydrogenation, Iron catalyst, Nitrogen-doped carbon nanotubes, Manganese promoter, Potassium promoter, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
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3
المؤلفون: Hiroshi Nishikawa, Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, C. R. Kao, Jiahui Li
المصدر: Journal of Materials Research and Technology, Vol 15, Iss, Pp 4541-4553 (2021)
مصطلحات موضوعية: business.product_category, Materials science, Intermetallic, chemistry.chemical_element, Sintering, Mechanical properties, Temperature cycling, Biomaterials, Micro-Ag sintering, Composite material, Mining engineering. Metallurgy, Ag–In intermetallic compounds, Metals and Alloys, TN1-997, Copper, Interconnection, Surfaces, Coatings and Films, Power (physics), Die attachment, chemistry, Transient liquid phase bonding, Ceramics and Composites, Die (manufacturing), business, Indium, Solid solution
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4
المؤلفون: Wolfgang Schmitt, Ly May Chew
المصدر: International Symposium on Microelectronics. 2018:000434-000441
مصطلحات موضوعية: business.product_category, Materials science, Sintering, chemistry.chemical_element, Substrate (electronics), Temperature cycling, Copper, chemistry.chemical_compound, chemistry, Silicon nitride, Automotive Engineering, Shear strength, Die (manufacturing), Brazing, Composite material, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::065eed169805aa7ab440cd7133447c5c
https://doi.org/10.4071/2380-4505-2018.1.000434 -
5
المؤلفون: Hiroshi Nishikawa, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Chin-Hao Tsai, C. Robert Kao
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Materials science, Energy conversion efficiency, Wide-bandgap semiconductor, Intermetallic, chemistry.chemical_element, Sintering, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), chemistry, Operating temperature, 0103 physical sciences, Composite material, 0210 nano-technology, Tin, Indium
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::45a1fb1135c08e9a3189a9e50e44457f
https://doi.org/10.1109/ectc32862.2020.00226 -
6
المؤلفون: Ly May Chew, Wolfgang Schmitt, Tamira Stegmann, Erika Schwenk
المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
مصطلحات موضوعية: Lead frame, Materials science, business.product_category, Soldering, Void (composites), Shear strength, Sintering, Die (manufacturing), Composite material, business, Inert gas, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e6ddebd5545b984e8fec96cf667b4b73
https://doi.org/10.1109/eptc47984.2019.9026669 -
7
المؤلفون: Michael Kaloudis, Ly May Chew, Jörg Franke, Christian Schwarzer, David Stenzel, Thomas Blank, Michael Schnepf
المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
مصطلحات موضوعية: business.product_category, Materials science, Sintering, chemistry.chemical_element, Copper, chemistry, Soldering, Ultimate tensile strength, Shear strength, Die (manufacturing), Adhesive, Composite material, business, Material properties
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b2f9a2dde14ca12fda12772ba075420
https://doi.org/10.23919/empc44848.2019.8951880 -
8
المؤلفون: Chanapa Kongmark, Praewpilin Kangvansura, Phatchada Santawaja, Holger Ruland, Wei Xia, Martin Muhler, Ly May Chew, Hans Schulz, Attera Worayingyong
المصدر: Engineering, Vol 3, Iss 3, Pp 385-392 (2017)
مصطلحات موضوعية: Iron catalyst, Environmental Engineering, Nitrogen-doped carbon nanotubes, General Computer Science, Materials Science (miscellaneous), General Chemical Engineering, Potassium, Inorganic chemistry, CO2 hydrogenation, Energy Engineering and Power Technology, chemistry.chemical_element, 02 engineering and technology, Manganese, engineering.material, 010402 general chemistry, 01 natural sciences, Catalysis, Ammonia, chemistry.chemical_compound, Manganese promoter, Wüstite, Olefin fiber, Chemistry, General Engineering, Potassium promoter, 021001 nanoscience & nanotechnology, Decomposition, 0104 chemical sciences, lcsh:TA1-2040, engineering, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), Space velocity
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9
المؤلفون: Yingyot Poo-arporn, Phatchada Santawaja, Praewpilin Kangvansura, Ly May Chew, Martin Muhler, Worasarit Saengsui, Hans Schulz, Attera Worayingyong
المصدر: Catalysis Today. 275:59-65
مصطلحات موضوعية: chemistry.chemical_classification, Alkene, Potassium, Inorganic chemistry, chemistry.chemical_element, Fischer–Tropsch process, 02 engineering and technology, General Chemistry, Manganese, 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, Catalysis, XANES, Product distribution, 0104 chemical sciences, chemistry, Methanation, 0210 nano-technology
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10
المؤلفون: Ly May Chew, Wolfgang Schmitt, Erika Schwenk, Tamira Stegmann, Monique Dubis
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, business.product_category, Materials science, Metallurgy, Sintering, chemistry.chemical_element, 02 engineering and technology, Direct bonding, 021001 nanoscience & nanotechnology, 01 natural sciences, Copper, Nickel, chemistry, Aluminium, Plating, 0103 physical sciences, Die (manufacturing), 0210 nano-technology, business, Layer (electronics)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f95ce9d2c2425439a27febc10c509524
https://doi.org/10.1109/ectc.2019.00021