المؤلفون: Osten, H. J., Dąbrowski, J., Müssig, H.-J., Fissel, A., Zavodinsky, V.

المساهمون: Hull, Robert, editor^Aff1, Osgood, R. M., Jr., editor^Aff2, Parisi, Jürgen, editor^Aff3, Warlimont, Hans, editor^Aff4, Dabrowski, Jarek, editor^Aff5, Weber, Eicke R., editor^Aff6

المصدر: Predictive Simulation of Semiconductor Processing : Status and Challenges. 72:259-294

المؤلفون: Dąbrowski, J., Weber, E. R., Müssig, H.-J., Schröter, W.

المساهمون: Hull, Robert, editor^Aff1, Osgood, R. M., Jr., editor^Aff2, Parisi, Jürgen, editor^Aff3, Warlimont, Hans, editor^Aff4, Dabrowski, Jarek, editor^Aff5, Weber, Eicke R., editor^Aff6

المصدر: Predictive Simulation of Semiconductor Processing : Status and Challenges. 72:1-38

المؤلفون: Dąbrowski, J.^Aff1, Müssig, H.-J.^Aff1, Duane, M.^Aff2, Dunham, S.T.^Aff3, Goossens, R.^Aff4, Vuong, H.-H.^Aff5

المساهمون: Kramer, Bernhard, editor

المصدر: Advances in Solid State Physics 38. 38:565-582

المؤلفون: Łupina, G., Seifarth, O., Kozłowski, G., Dudek, P., Dąbrowski, J., Lippert, G., Müssig, H.-J.

المصدر: In Microelectronic Engineering 2009 86(7):1842-1844

المؤلفون: Schroeder, T., Giussani, A., Muessig, H.-J., Weidner, G., Costina, I., Wenger, Ch., Lukosius, M., Storck, P., Zaumseil, P.

المصدر: In Microelectronic Engineering 2009 86(7):1615-1620

المؤلفون: Wenger, Ch., Lukosius, M., Weidner, G., Müssig, H.-J., Pasko, S., Lohe, Ch.

المصدر: In Thin Solid Films 2009 517(23):6334-6336

المؤلفون: Wenger, Ch., Lukosius, M., Costina, I., Sorge, R., Dabrowski, J., Müssig, H.-J., Pasko, S., Lohe, Ch.

المصدر: In Microelectronic Engineering 2008 85(8):1762-1765

المؤلفون: Lukosius, M., Wenger, Ch., Schroeder, T., Dabrowski, J., Sorge, R., Costina, I., Müssig, H.-J., Pasko, S., Lohe, Ch.

المصدر: In Microelectronic Engineering 2007 84(9):2165-2168

المؤلفون: Müssig, H. J., Dabrowski, J., Hinrich, S.

المصدر: MRS Online Proceedings Library. 567(1):169-180

المؤلفون: Wenger, Ch., Sorge, R., Schroeder, T., Mane, A.U., Lippert, G., Lupina, G., Dąbrowski, J., Zaumseil, P., Muessig, H.-J.

المصدر: In Microelectronic Engineering 17 June 2005 80:313-316