المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, B. Wunderle, M. Abo Ras

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9cf1612f430eae8555a93daba8f93e5
https://doi.org/10.1109/eurosime56861.2023.10100762

المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, R. Schacht, M. Abo Ras, B. Wunderle

المصدر: Microelectronics Reliability. 142:114910

مصطلحات موضوعية: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::972bbb787f76c0d694d0adac2423f612
https://doi.org/10.1016/j.microrel.2023.114910

المؤلفون: D. May, J. Heilmann, M. Schulz, E. Boschman, M. Abo Ras, B. Wunderle

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d66e2ade2157315359e1f19e1f296ef0
https://doi.org/10.1109/eurosime54907.2022.9758871

المؤلفون: S. Panahandeh, D. May, C. Grosse-Kockert, A. Stelzer, B. Rabay, D. Busse, B. Wunderle, M. Abo Ras

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::502d8284a4beb10267fed64d594f81e8
https://doi.org/10.1109/eurosime54907.2022.9758907

المؤلفون: S Panahandeh, D May, C Grosse-Kockert, B Wunderle, M Abo Ras

المصدر: Proceedings of the 2022 International Conference on Quantitative InfraRed Thermography.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6477d538a68f822ed91ab3b2326e8943
https://doi.org/10.21611/qirt.2022.2008

المؤلفون: Ralph Schacht, M. Abo Ras, Bernhard Wunderle, Dan R. Wargulski, Daniel May, J. Petrick

المصدر: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

مصطلحات موضوعية: Materials science, Silicon, 010401 analytical chemistry, Metallurgy, chemistry.chemical_element, 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, 0104 chemical sciences, Low emissivity, chemistry, visual_art, Soldering, Thermography, Electronic component, 0202 electrical engineering, electronic engineering, information engineering, Emissivity, visual_art.visual_art_medium, Coupling (piping), Graphite

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3c9e1e0086a52a681855a140494abf4
https://doi.org/10.1109/therminic49743.2020.9420531

المؤلفون: Dan R. Wargulski, Daniel May, M. Abo Ras, E. Boschman, Bernhard Wunderle, C. Grosse-Kockert

المصدر: Quantitative InfraRed Thermography Conference
Proceedings of the 2020 International Conference on Quantitative InfraRed Thermography

مصطلحات موضوعية: Flash-lamp, Materials science, business.industry, Infrared, law, Thermography, Optoelectronics, business, Laser, Die (integrated circuit), Excitation, law.invention

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f614c7ca66521dae6fe4a870e82037f6

المؤلفون: M. Abo Ras, J. Hirscheider, Ralph Schacht, J. Heilmann, J. Arnold, Bernhard Wunderle, Y. Li, Daniel May, Jörg Bauer

المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

مصطلحات موضوعية: 010302 applied physics, Materials science, Mechanical engineering, System testing, Thermal grease, 02 engineering and technology, Temperature cycling, Heat sink, 021001 nanoscience & nanotechnology, Fluid transport, 01 natural sciences, Thermal conductivity, Power module, 0103 physical sciences, Heat transfer, 0210 nano-technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::df954e98be8ab820d1f7d596e1d69a5e
https://doi.org/10.1109/eurosime.2019.8724540

المؤلفون: Marcus Schulz, M. Abo Ras, Bernhard Wunderle, R. Mrosko

المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

مصطلحات موضوعية: Lead frame, Digital image correlation, Materials science, Fracture toughness, Fracture (geology), Bending, Composite material, Displacement (vector), Beam (structure), Finite element method

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24503f5886278e710e7e38a9fb6dcd25
https://doi.org/10.1109/eurosime.2019.8724564

المؤلفون: Zoltan Sarkany, C. A. Manier, M. Springborn, J. Heilmann, Hermann Oppermann, Bernhard Wunderle, Radoslava Mitova, M. Abo Ras, Daniel May

المصدر: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

مصطلحات موضوعية: Computer science, business.industry, 020209 energy, 02 engineering and technology, Thermal energy storage, Phase-change material, Form factor (design), Heat pipe, Reliability (semiconductor), Power module, Power electronics, 0202 electrical engineering, electronic engineering, information engineering, Process engineering, business, Design technology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b3fe9f1c50cd9d091994ba5ee22039f8
https://doi.org/10.1109/therminic.2018.8593293