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1دورية أكاديمية
المؤلفون: W. Schwarzenbach, B.-Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Maleville
المصدر: IEEE Journal of the Electron Devices Society, Vol 7, Pp 863-868 (2019)
مصطلحات موضوعية: FD-SOI, SmartCut, 3D integration, low temperature, CMOS, Electrical engineering. Electronics. Nuclear engineering, TK1-9971
وصف الملف: electronic resource
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2
المؤلفون: E. Cela, Christophe Maleville, Ludovic Ecarnot, C. Maddalon, Nicolas Daval, S. Loubriat, C. Bertrand-Giuliani, Walter Schwarzenbach, Bich-Yen Nguyen, G. Chabanne, M. Detard
المصدر: IEEE Journal of the Electron Devices Society
مصطلحات موضوعية: 010302 applied physics, Materials science, business.industry, Point density, Silicon on insulator, High density, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Temperature measurement, Layer thickness, Electronic, Optical and Magnetic Materials, 0103 physical sciences, Optoelectronics, Wafer, Electrical and Electronic Engineering, 0210 nano-technology, business, Layer (electronics), Biotechnology
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3
المؤلفون: Christophe Girard, M. Detard, E. Cela, Nicolas Daval, G. Chabanne, C. Bertrand-Giuliani, Christophe Maleville, Ludovic Ecarnot, Bich-Yen Nguyen, Walter Schwarzenbach, S. Loubriat, C. Maddalon
المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
مصطلحات موضوعية: business.industry, Computer science, Automotive industry, Electrical engineering, Silicon on insulator, High density, Hardware_PERFORMANCEANDRELIABILITY, Buried oxide, Planar, Semiconductor, Hardware_INTEGRATEDCIRCUITS, business, Wearable technology, Electronic circuit
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4مؤتمر
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