المؤلفون: Mohammed A. Al-Rahman, Saeed A.A. Ibrahim, M. Elfaisal Elrefaie

المصدر: Journal of Applied and Computational Mechanics, Vol 10, Iss 2, Pp 304-316 (2024)

مصطلحات موضوعية: heat sink, vapor chamber, thermal resistance, electronic devices cooling, Mechanics of engineering. Applied mechanics, TA349-359

وصف الملف: electronic resource

Relation: https://jacm.scu.ac.ir/article_18606_b3f704b51a42b3acc17cb15f443640b4.pdf; https://doaj.org/toc/2383-4536

URL الوصول: https://doaj.org/article/778c1bd8639d498db0347d24af9d3a39