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المؤلفون: B. Sell, S. An, J. Armstrong, D. Bahr, B. Bains, R. Bambery, K. Bang, D. Basu, S. Bendapudi, D. Bergstrom, R. Bhandavat, S. Bhowmick, M. Buehler, D. Caselli, S. Cekli, Vrsk. Chaganti, Y. J. Chang, K. Chikkadi, T. Chu, T. Crimmins, G. Darby, C. Ege, P. Elfick, T. Elko-Hansen, S. Fang, C. Gaddam, M. Ghoneim, H. Gomez, S. Govindaraju, Z. Guo, W. Hafez, M. Haran, M. Hattendorf, S. Hu, A. Jain, S. Jaloviar, M. Jang, J. Kameswaran, V. Kapinus, A. Kennedy, S. Klopcic, D. Krishnan, J. Leib, Y.-T. Lin, N. Lindert, G. Liu, O. Loh, Y. Luo, S. Mani, M. Mleczko, S. Mocherla, P. Packan, M. Paik, A. Paliwal, R. Pandey, K. Patankar, L. Pipes, P. Plekhanov, C. Prasad, M. Prince, G. Ramalingam, R. Ramaswamy, J. Riley, J. R. Sanchez Perez, J. Sandford, A. Sathe, F. Shah, H. Shim, S. Subramanian, S. Tandon, M. Tanniru, D. Thakurta, T. Troeger, X. Wang, C. Ward, A. Welsh, S. Wickramaratne, J. Wnuk, S. Q. Xu, P. Yashar, J. Yaung, K. Yoon, N. Young
المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::226c1fc04b9265eb60d875c5c1f4a89c
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830194 -
2دورية أكاديمية
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تسجيل الدخول للوصول الكامل. -
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المؤلفون: Yeoh Andrew W, W. Han, Manvi Sharma, J. Shin, I. Post, M. Tanniru, T. Mule, Madhavan Atul, Gerald S. Leatherman, Kevin J. Fischer, Y-H. Wu, M. Sprinkle, Prasun Sinha, S. Anand, J. Steigerwald, S. Nigam, V. Souw, C. Ganpule, M. Asoro, Haran Mohit K, K-S. Lee, C. Pelto, P. Yashar, S. Samarajeewa, M. Mori, A. Tripathi, S. Kirby, C. Auth, M. Aykol, H. Hiramatsu, K. Marla, H. Jeedigunta, V. Chikarmane, M. Buehler, Nicholas J. Kybert
المصدر: 2018 IEEE International Interconnect Technology Conference (IITC).
مصطلحات موضوعية: Interconnection, Materials science, business.industry, 020209 energy, 02 engineering and technology, 021001 nanoscience & nanotechnology, Electromigration, High volume manufacturing, Stack (abstract data type), Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Multiple patterning, Optoelectronics, Node (circuits), 0210 nano-technology, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0fa7cc3fb3c8d31dc8c2da50fdf17147
https://doi.org/10.1109/iitc.2018.8430489 -
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المؤلفون: M. Tanniru, Raja Devesh Kumar Misra
المصدر: Materials Science and Engineering: A. 424:53-70
مصطلحات موضوعية: Materials science, Mechanical Engineering, Stress-whitening, Polyethylene, Plasticity, Condensed Matter Physics, Stress (mechanics), chemistry.chemical_compound, Crystallinity, chemistry, Mechanics of Materials, Ultimate tensile strength, General Materials Science, High-density polyethylene, Deformation (engineering), Composite material
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المؤلفون: M. Tanniru, R.D.K. Misra, Q. Yuan
المصدر: Polymer. 47:2133-2146
مصطلحات موضوعية: Materials science, Nanocomposite, Polymers and Plastics, Scanning electron microscope, Organic Chemistry, Izod impact strength test, Dynamic mechanical analysis, Polyethylene, chemistry.chemical_compound, Differential scanning calorimetry, chemistry, Materials Chemistry, High-density polyethylene, Deformation (engineering), Composite material
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المؤلفون: Raja Devesh Kumar Misra, M. Tanniru
المصدر: Materials Science and Engineering: A. 405:178-193
مصطلحات موضوعية: Materials science, Mechanical Engineering, Composite number, Izod impact strength test, Polyethylene, Condensed Matter Physics, Microstructure, Crystallinity, chemistry.chemical_compound, Calcium carbonate, Brittleness, chemistry, Mechanics of Materials, General Materials Science, High-density polyethylene, Composite material
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المؤلفون: K. Berbrand, Raja Devesh Kumar Misra, M. Tanniru, D. Murphy
المصدر: Materials Science and Engineering: A. 404:208-220
مصطلحات موضوعية: Materials science, integumentary system, Mechanical Engineering, Stress-whitening, Scratch hardness, Young's modulus, Polyethylene, Condensed Matter Physics, eye diseases, chemistry.chemical_compound, symbols.namesake, stomatognathic system, chemistry, Mechanics of Materials, Scratch, symbols, General Materials Science, sense organs, High-density polyethylene, Deformation (engineering), Composite material, skin and connective tissue diseases, computer, Elastic modulus, computer.programming_language
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المؤلفون: D. Panda, M. Tanniru, S. Shanmugam, Raja Devesh Kumar Misra, S. Jansto
المصدر: Materials Science and Technology. 21:883-892
مصطلحات موضوعية: Austenite, Materials science, Precipitation (chemistry), Mechanical Engineering, Metallurgy, Niobium, Vanadium, chemistry.chemical_element, engineering.material, Condensed Matter Physics, Carbide, chemistry, Mechanics of Materials, Ferrite (iron), engineering, General Materials Science, Microalloyed steel, Titanium
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المؤلفون: D. Panda, M. Tanniru, S. Jansto, Raja Devesh Kumar Misra, S. Shanmugam
المصدر: Materials Science and Technology. 21:159-164
مصطلحات موضوعية: Toughness, Materials science, Mechanical Engineering, Metallurgy, Flange, Condensed Matter Physics, Microstructure, Mechanics of Materials, Ferrite (iron), Ferrite pearlite, General Materials Science, Grain boundary, Pearlite, Elongation, Composite material
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المؤلفون: Raja Devesh Kumar Misra, S. Jansto, S. Shanmugam, D. Panda, M. Tanniru
المصدر: Materials Science and Technology. 21:165-177
مصطلحات موضوعية: Materials science, Mechanics of Materials, Transmission electron microscopy, Precipitation (chemistry), law, Mechanical Engineering, Metallurgy, General Materials Science, Electron microscope, Condensed Matter Physics, Comparative evaluation, law.invention