يعرض 1 - 10 نتائج من 424 نتيجة بحث عن '"MIS-HEMTs"', وقت الاستعلام: 1.17s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(3):428-436 Sep, 2024

  2. 2
    مؤتمر

    المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :1-3 Jun, 2024

    Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(5):2914-2919 May, 2024

  4. 4
    دورية أكاديمية

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(5):2920-2924 May, 2024

  5. 5
    دورية أكاديمية

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2349-2354 Apr, 2024

  6. 6
    دورية أكاديمية

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):1792-1797 Mar, 2024

  7. 7
  8. 8
    مؤتمر

    المصدر: 2023 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2023 International Conference on. :52-56 Sep, 2023

    Relation: 2023 International Conference on IC Design and Technology (ICICDT)

  9. 9
    مؤتمر

    المصدر: 2023 35th International Conference on Microelectronic Test Structure (ICMTS) Microelectronic Test Structure (ICMTS), 2023 35th International Conference on. :1-4 Mar, 2023

    Relation: 2023 35th International Conference on Microelectronic Test Structure (ICMTS)

  10. 10
    دورية أكاديمية

    المصدر: IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 33(7):1011-1014 Jul, 2023