المؤلفون: Bargiel, Sylwester, Zamkotsian, Frederic, Gauthier-Manuel, Ludovic, Balharet, Djaffar, Salut, Roland

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Qu, Z., Ouyang, H., Xiong, W., Xu, Q., Wang, Y., Liu, H.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(6):6418-6426 Jun, 2024

المؤلفون: Struk, P., Bargiel, S., Jozwik, M., Mirecki, B., Wojtkowski, M., Xie, H., Gorecki, C.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(9):13903-13913 May, 2024

المؤلفون: Yang, X., Xia, D., Fu, B., Li, J., Zhao, J., Chu, Q.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(7):9489-9497 Apr, 2024

المؤلفون: Li, G., Cai, C., Zhang, Y., Deng, X., Lin, L., Xiao, W.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(4):4304-4314 Feb, 2024

المؤلفون: Liu, Yujian, Li, Cheng, Wu, Zhengwei, Fan, Shangchun, Wan, Zhen, Han, Song

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1774-1777 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Guerreiro, Sara, Bainschab, Markus, Piot, Adrien, Rocha, Rodrigo Tumolin, Toshiyoshi, Hiroshi, Bosseboeuf, Alain, Sasaki, Takashi, Lagosh, Anton, Moridi, Mohssen

المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-6 May, 2023

Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Goldman, D.A., Serra, P., Kacker, S., Benney, L., Vresilovic, D., Spector, S.J., Cahoy, K., Wachs, J.S.

المصدر: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 41(9):2675-2690 May, 2023

المؤلفون: Yang, X., Xia, D., Li, J., Chu, Q.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(1):181-188 Jan, 2023

المؤلفون: Barbin, Evgenij S., Nesterenko, Tamara G., Koleda, Aleksej N., Shesterikov, Evgeniy V., Kulinich, Ivan V., Kokolov, Andrey A.

المصدر: 2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2022 IEEE 23rd International Conference of. :42-47 Jun, 2022

Relation: 2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM)