المؤلفون: Ryabova, N. V., Elchaninova, A. S., Konkin, N. A.

المصدر: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2024. :1-4 Jun, 2024

Relation: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)

المؤلفون: Ivanov, D. V., Elchaninova, A. S., Konkin, N. A.

المصدر: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2024. :1-4 Jun, 2024

Relation: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)

المؤلفون: Kim, Kwiwook, Park, Myeong-jae

المصدر: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024

Relation: 2024 IEEE International Memory Workshop (IMW)

المؤلفون: Liu, J.M, Yao, J.Z, Wei, Peter, Jiang, Ruby, Pang, Xingshou, Xu, Sean, Li, Leo

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :340-345 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Islam, Md Ashraful, Hossam-E-Haider, Md

المصدر: 2023 International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD) Information and Communication Technology for Sustainable Development (ICICT4SD), 2023 International Conference on. :199-203 Sep, 2023

Relation: 2023 International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD)

المؤلفون: Kubota, T., Oshida, H., Hayashiguchi, S., Kajikawa, Y.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :177-178 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Murai, Kosuke, Onozeki, Hitoshi, Kang, Dongchul, Hirano, Kazue, Mitsukura, Kazuyki

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :899-906 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, J., Shi, Y., Yang, C., Zhang, Z., Zhao, L.

المصدر: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 71(6):5189-5198 Jun, 2023

المؤلفون: Ashraful Islam, Md^Aff13, Hossam-E-Haider, Md^Aff13

المساهمون: Kacprzyk, Janusz, Series Editor^Aff1, Gomide, Fernando, Advisory Editor^Aff2, Kaynak, Okyay, Advisory Editor^Aff3, Liu, Derong, Advisory Editor^Aff4, Pedrycz, Witold, Advisory Editor^Aff5, Polycarpou, Marios M., Advisory Editor^Aff6, Rudas, Imre J., Advisory Editor^Aff7, Wang, Jun, Advisory Editor^Aff8, Iglesias, Andres, editor^Aff9, Shin, Jungpil, editor^Aff10, Patel, Bharat, editor^Aff11, Joshi, Amit, editor^Aff12

المصدر: Proceedings of World Conference on Information Systems for Business Management : ISBM 2023, Volume 2. 834:327-337

المؤلفون: Azmi, Muhammad Afiq, Abdullah, Mohd Zulkifly, Shuib, Raa Khimi, Ariff, Zulkifli Mohamad, Loh, Wei Keat, Ooi, Renn Chan, Ooi, Chun Keang, Abdullah, Muhammad Khalil^{Aff1, IDs00289023048056_cor8}

المصدر: Polymer Bulletin. 81(3):2385-2406