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1مؤتمر
المؤلفون: Ryabova, N. V., Elchaninova, A. S., Konkin, N. A.
المصدر: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2024. :1-4 Jun, 2024
Relation: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)
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2مؤتمر
المؤلفون: Ivanov, D. V., Elchaninova, A. S., Konkin, N. A.
المصدر: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF) Wave Electronics and its Application in Information and Telecommunication Systems (WECONF), 2024. :1-4 Jun, 2024
Relation: 2024 Wave Electronics and its Application in Information and Telecommunication Systems (WECONF)
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3مؤتمر
المؤلفون: Kim, Kwiwook, Park, Myeong-jae
المصدر: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024
Relation: 2024 IEEE International Memory Workshop (IMW)
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4مؤتمر
المؤلفون: Liu, J.M, Yao, J.Z, Wei, Peter, Jiang, Ruby, Pang, Xingshou, Xu, Sean, Li, Leo
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :340-345 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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5مؤتمر
المؤلفون: Islam, Md Ashraful, Hossam-E-Haider, Md
المصدر: 2023 International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD) Information and Communication Technology for Sustainable Development (ICICT4SD), 2023 International Conference on. :199-203 Sep, 2023
Relation: 2023 International Conference on Information and Communication Technology for Sustainable Development (ICICT4SD)
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6مؤتمر
المؤلفون: Kubota, T., Oshida, H., Hayashiguchi, S., Kajikawa, Y.
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :177-178 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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7مؤتمر
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :899-906 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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8دورية أكاديمية
المصدر: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 71(6):5189-5198 Jun, 2023
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9كتاب إلكتروني
المؤلفون: Ashraful Islam, MdAff13, Hossam-E-Haider, MdAff13
المساهمون: Kacprzyk, Janusz, Series EditorAff1, Gomide, Fernando, Advisory EditorAff2, Kaynak, Okyay, Advisory EditorAff3, Liu, Derong, Advisory EditorAff4, Pedrycz, Witold, Advisory EditorAff5, Polycarpou, Marios M., Advisory EditorAff6, Rudas, Imre J., Advisory EditorAff7, Wang, Jun, Advisory EditorAff8, Iglesias, Andres, editorAff9, Shin, Jungpil, editorAff10, Patel, Bharat, editorAff11, Joshi, Amit, editorAff12
المصدر: Proceedings of World Conference on Information Systems for Business Management : ISBM 2023, Volume 2. 834:327-337
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10دورية أكاديمية
المؤلفون: Azmi, Muhammad Afiq, Abdullah, Mohd Zulkifly, Shuib, Raa Khimi, Ariff, Zulkifli Mohamad, Loh, Wei Keat, Ooi, Renn Chan, Ooi, Chun Keang, Abdullah, Muhammad KhalilAff1, IDs00289023048056_cor8
المصدر: Polymer Bulletin. 81(3):2385-2406