المؤلفون: Qiu, Hengkang, Zhao, Wenqi^{Aff1, IDs11664024110188_cor2}, Wang, Wenqiang, Fu, Chune, Wang, Yinchao, Su, Baofa, Ma, Jusha, Li, Xuping, Zhao, Changjiang

المصدر: Journal of Electronic Materials. 53(6):3309-3319

المؤلفون: Ding, Yuhan, Huang, Linjun, Shen, Chen^{Aff1, IDs11665024092455_cor3}, Wang, Zhichao, Ma, Jusha, Wang, Xunchun, Cai, Yan, Hua, Xueming^{Aff1, IDs11665024092455_cor8}

المصدر: Journal of Materials Engineering and Performance. :1-16

المؤلفون: Ding, Yuhan, Li, Xiaoran, Wang, Xunchun, Ma, Jusha, Shen, Chen, Hua, Xueming, Wang, Min, Wang, Lin, Qian, Bin

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wu, Guanzhi^Aff7, Chen, Nannan^Aff7, Wang, Zhichao^Aff8, Wei, Yi^Aff8, Ma, Jusha^Aff8, Wang, Min^Aff7, Shen, Chen^Aff7, Ding, Yuhan^Aff7, Pei, Yafei^Aff7, Qian, Bin^Aff8, Hua, Xueming^Aff7

المساهمون: Chen, Shanben, Editor-in-Chief^{Aff1, Aff4}, Zhang, Yuming, Editor-in-Chief^{Aff2, Aff5}, Feng, Zhili, Editor-in-Chief^{Aff3, Aff6}

المصدر: Transactions on Intelligent Welding Manufacturing : Volume V No. 1 2021. :42-55

المؤلفون: Chen, Nannan^Aff7, Wang, Zhichao^Aff8, Wei, Yi^Aff8, Ma, Jusha^Aff8, Wang, Min^Aff7, Shen, Chen^Aff7, Ding, Yuhan^Aff7, Wu, Guanzhi^Aff7, Qian, Bin^Aff8, Hua, Xueming^Aff7

المساهمون: Chen, Shanben, Editor-in-Chief^{Aff1, Aff4}, Zhang, Yuming, Editor-in-Chief^{Aff2, Aff5}, Feng, Zhili, Editor-in-Chief^{Aff3, Aff6}

المصدر: Transactions on Intelligent Welding Manufacturing : Volume V No. 2 2021. :69-85

المؤلفون: Ding, Yuhan, Wang, Zhichao, Hua, Xueming, Shen, Chen, Wang, Min, Ma, Jusha, Qian, Bin

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Ding, Yuhan, Wang, Zhichao, Ma, Jusha, Shen, Chen, Wang, Kai, Chen, Nannan, Wei, Yi, Wu, Guanzhi, Cai, Yan, Wang, Lin, Qian, Bin, Hua, Xueming

المصدر: In Materials Today Communications June 2024 39

المؤلفون: Wu, Guanzhi, Chen, Nannan, Wang, Zhichao, Wei, Yi, Ma, Jusha, Wang, Min, Chen, Ke, Shen, Chen, Ding, Yuhan, Pei, Yafei, Qian, Bin, Hua, Xueming

المصدر: In Journal of Materials Processing Tech. June 2024 327

المؤلفون: Rajan, Raj Thilak, Ben-Maor, Shoshana, Kaderali, Shaziana, Turner, Calum, Milhim, Mohammed, Melograna, Catrina, Haken, Dawn, Paul, Gary, Vedant, V, Sreekumar, Weppler, Johannes, Gumulya, Yosephine, Bunt, Riccardo, Bulgarini, Asia, Marnat, Maurice, Bussov, Kadri, Pringle, Frederick, Ma, Jusha, Amrutkar, Rushanka, Coto, Miguel, He, Jiang, Shi, Zijian, Hayder, Shahd, Jaber, Dina Saad Fayez, Zuo, Junchao, Alsukour, Mohammad, Renaud, Cecile, Christie, Matthew, Engad, Neta, Lian, Yu, Wen, Jie, McAvinia, Ruth, Simon-Butler, Andrew, Nguyen, Anh, Cohen, Jacob

المصدر: Acta Astronautica, Elsevier, 2021

مصطلحات موضوعية: Astrophysics - Instrumentation and Methods for Astrophysics, Electrical Engineering and Systems Science - Systems and Control

URL الوصول: http://arxiv.org/abs/2107.01601

المؤلفون: Wang, Kai, Ma, Jusha, Li, Yi, Ding, Yuhan, Chen, Nanliang, Shao, Huiqi, Jiang, Jinhua

المصدر: In Surface & Coatings Technology 30 April 2024 482