المؤلفون: Wu, Shaocheng, Xu, Rongbin, Guo, Bingliang, Ma, Yinggong, Yu, Daquan

المصدر: In Materials Science in Semiconductor Processing January 2024 169

المؤلفون: Guo, Bingliang, Dong, Boyu, Wu, Xuewei, Li, Xinying, Wu, Shubo, Yang, Yilong, Liu, Yujie, Zhang, Jiahao, Zhang, Lu, Chen, Yujing, Zhao, Chenguang, Ma, Yinggong, Shi, Xiaoping, Wang, Hougong, Ding, Peijun

المصدر: 2019 China Semiconductor Technology International Conference (CSTIC) China Semiconductor Technology International Conference (CSTIC), 2019. :1-3 Mar, 2019

Relation: 2019 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Wang, Yonghua, Kou, Zili, Liu, Yinjuan, Liu, Fangming, Duan, Wenrui, Deng, Jirui, Ma, Yinggong, Ma, Dejiang, Tan, Lijie, Li, Chunxia, Zhang, Yajie, He, Duanwei

المصدر: In International Journal of Refractory Metals and Hard Materials January 2016 54:203-209

المؤلفون: Wu Shubo, Ding Peijun, Chen Yujing, Li Xinying, Zhang Jiahao, Wu Xuewei, Zhang Lu, Zhao Chenguang, Guo Bingliang, Dong Boyu, Ma Yinggong, Yang Yilong, Xiaoping Shi, Hougong Wang, Liu Yujie

المصدر: 2019 China Semiconductor Technology International Conference (CSTIC).

مصطلحات موضوعية: Full width at half maximum, Materials science, business.industry, Physical vapor deposition, Optoelectronics, Microelectronics, Substrate (electronics), Metalorganic vapour phase epitaxy, Chemical vapor deposition, business, Epitaxy, Layer (electronics)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::145ddaf42662c7742494e117a1be9ffd
https://doi.org/10.1109/cstic.2019.8755770