المؤلفون: Sciuto, Alberto, Deretzis, Ioannis, Fisicaro, Giuseppe, Lombardo, Salvatore F., Magna, Antonino La, Grimaldi, Maria Grazia, Huet, Karim, Lespinasse, Bobby, Verstraete, Armand, Curvers, Benoit, Bejenari, Igor, Burenkov, Alexander, Pichler, Peter

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :71-74 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Lombardo, V., Di Franco, S., D'Urso, L., Magna, A. La, Terrasi, A., Puglisi, R. A.

المصدر: 2018 IEEE 4th International Forum on Research and Technology for Society and Industry (RTSI) Research and Technology for Society and Industry (RTSI), 2018 IEEE 4th International Forum on. :1-5 Sep, 2018

Relation: 2018 IEEE 4th International Forum on Research and Technology for Society and Industry (RTSI)

المؤلفون: Tabata, Toshiyuki, Aubin, Joris, Huet, Karim, Mazzamuto, Fulvio, Magna, Antonino La, Rubin, Leonard M., Kopalidis, Petros, Tsai, Hao-Cheng, Roh, Dwight, Reece, Ronald

المصدر: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :130-132 Mar, 2019

Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)

المؤلفون: Cristiano, F., Qiu, Y., Bedel-Pereira, E., Huet, K., Mazzamuto, F., Fisicaro, G., Magna, A. La, Quillec, M., Cherkashin, N., Wang, H., Duguay, S., Blavette, D.

المصدر: 2014 International Workshop on Junction Technology (IWJT) Junction Technology (IWJT), 2014 International Workshop on. :1-6 May, 2014

Relation: 2014 14th International Workshop on Junction Technology (IWJT)

المؤلفون: Fisicaro, G., Pelaz, L., Aboy, M., Lopez, P., Italia, M., Huet, K., Cristiano, F., Essa, Z., Yang, Q., Bedel-Pereira, E., Hackenberg, M., Pichler, P., Quillec, M., Taleb, N., Magna, A. La

المصدر: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on. :33-36 Sep, 2013

Relation: 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Hackenberg, M., Rommel, M., Rumler, M., Lorenz, J., Pichler, P., Huet, K., Negru, R., Fisicaro, G., Magna, A. La, Taleb, N., Quillec, M.

المصدر: 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European. :214-217 Sep, 2013

Relation: ESSDERC 2013 - 43rd European Solid State Device Research Conference

المؤلفون: Deretzis, Ioannis, Giannazzo, Filippo, Angilella, Giuseppe G. N., Parisi, Luca, Magna, Antonino La

المصدر: 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC) Nanotechnology Materials and Devices Conference (NMDC), 2016 IEEE. :1-2 Oct, 2016

Relation: 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC)

المؤلفون: Fiorenza, P., Magna, A. La, Vivona, M., Giannazzo, F., Roccaforte, F.

المصدر: 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM) Silicon Carbide & Related Materials (ECSCRM), European Conference on. :1-1 Sep, 2016

Relation: 2016 European Conference on Silicon Carbide & Related Materials (ECSCRM)

المؤلفون: Fisicaro, G., Magna, A. La, Piccitto, G., Privitera, V., Huet, K., Venturini, J., Besaucele, H.

المصدر: 2009 17th International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2009. RTP '09. 17th International Conference on. :1-4 Sep, 2009

Relation: 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP)

المؤلفون: Patanè, Andrea^Aff1, Santoro, Andrea^Aff2, Romano, Vittorio^Aff3, Magna, Antonino La^Aff4, Nicosia, Giuseppe^{Aff3, Aff5, Aff6}

المصدر: Journal of Global Optimization: An International Journal Dealing with Theoretical and Computational Aspects of Seeking Global Optima and Their Applications in Science, Management and Engineering. 72(3):491-515