يعرض 1 - 10 نتائج من 146,397 نتيجة بحث عن '"Maia, IS"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    رسالة جامعية

    المؤلفون: Amorim Maia, Ana Terra

    مرشدي الرسالة: Timothy Connolly, James John, Chu, Eric K., Anguelovski, Isabelle

    المصدر: TDX (Tesis Doctorals en Xarxa)

    وصف الملف: application/pdf

  2. 2
    دورية أكاديمية

    المصدر: Revista Brasileira de Terapia Intensiva. March 2022 34(1)

    وصف الملف: text/html

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    مؤتمر

    المصدر: 2024 IEEE 18th International Conference on Automatic Face and Gesture Recognition (FG) Automatic Face and Gesture Recognition (FG), 2024 IEEE 18th International Conference on. :1-10 May, 2024

    Relation: 2024 IEEE 18th International Conference on Automatic Face and Gesture Recognition (FG)

  5. 5
    مؤتمر

    المصدر: 2024 IEEE UFFC Latin America Ultrasonics Symposium (LAUS) Ultrasonics Symposium (LAUS), 2024 IEEE UFFC Latin America. :1-4 May, 2024

    Relation: 2024 IEEE UFFC Latin America Ultrasonics Symposium (LAUS)

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    مؤتمر

    المصدر: 2024 IEEE UFFC Latin America Ultrasonics Symposium (LAUS) Ultrasonics Symposium (LAUS), 2024 IEEE UFFC Latin America. :1-4 May, 2024

    Relation: 2024 IEEE UFFC Latin America Ultrasonics Symposium (LAUS)

  7. 7
    مؤتمر

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

  8. 8
    مؤتمر

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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    مؤتمر

    المصدر: 2024 IEEE South Asian Ultrasonics Symposium (SAUS) South Asian Ultrasonics Symposium (SAUS), 2024 IEEE. :1-4 Mar, 2024

    Relation: 2024 IEEE South Asian Ultrasonics Symposium (SAUS)

  10. 10
    مؤتمر

    المصدر: 2024 16th International Conference on Computer and Automation Engineering (ICCAE) Computer and Automation Engineering (ICCAE), 2024 16th International Conference on. :203-210 Mar, 2024

    Relation: 2024 16th International Conference on Computer and Automation Engineering (ICCAE)