المؤلفون: Baranowski, Jerzy, Kucharska, Edyta, Kawalec, Magdalena, Malinowski, Pawel, Piwowarski, Grzegorz

المصدر: 2023 IEEE 10th International Conference on E-Learning in Industrial Electronics (ICELIE) E-Learning in Industrial Electronics (ICELIE), 2023 IEEE 10th International Conference on. :1-6 Oct, 2023

Relation: 2023 IEEE 10th International Conference on E-Learning in Industrial Electronics (ICELIE)

المؤلفون: Liu, Jeffrey^Aff5, Malinowski, Paweł H.^Aff6, Pawłowski, Piotr^Aff7, Wu, Zihan^Aff8, Todd, Michael D.^Aff8

المساهمون: Zimmerman, Kristin B., Series Editor^Aff1, Allen, Matthew, editor^Aff2, Blough, Jason, editor^Aff3, Mains, Michael, editor^Aff4

المصدر: Special Topics in Structural Dynamics & Experimental Techniques, Volume 5 : Proceedings of the 41st IMAC, A Conference and Exposition on Structural Dynamics 2023. :51-55

المؤلفون: Li, Yunlong, Karve, Gauri, Malinowski, Pawel E., Kim, Joo Hyoung, Georgitzikis, Epimitheas, Pejovic, Vladimir, Lim, Myung-Jin, Hagelsieb, Luis Moreno, Puybaret, Renaud, Lieberman, Itai, Lee, Jiwon, Cheyns, David, Heremans, Paul, Osman, Haris, Tezcan, Deniz Sabuncuoglu

المصدر: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :349-350 Jun, 2022

Relation: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

المؤلفون: Ke, Tung-Huei, Sandehang, Calvin Mona, Tsai, Chi-Ting, Alvarez, Gema Molina, Vandenplas, Erwin, Horemans, Paul, Malinowski, Pawel E.

المصدر: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021

Relation: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Singh, Shishir Kumar, Soman, Rohan N., Malinowski, Paweł H.

المصدر: In Mechanical Systems and Signal Processing 1 July 2024 216

المؤلفون: Georgitzikis, Epimitheas, Malinowski, Pawel E., Hagclsieb, Luis Moreno, Pejovic, Vladimir, Uytterhoeven, Griet, Guerrieri, Stefano, Suss, Andreas, Cavaco, Celso, Chatzinis, Konstantinos, Maes, Jorick, Hens, Zeger, Heremans, Paul, Cheyns, David

المصدر: 2018 IEEE SENSORS SENSORS, 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SENSORS

المؤلفون: Fakih, Mohammad Ali^Aff10, Singh, Shishir Kumar^Aff10, Mustapha, Samir^Aff11, Malinowski, Paweł^Aff10

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Rizzo, Piervincenzo, editor^Aff8, Milazzo, Alberto, editor^Aff9

المصدر: European Workshop on Structural Health Monitoring : EWSHM 2022 - Volume 3. 270:195-203

المؤلفون: Balasubramaniam, Kaleeswaran^Aff10, Soman, Rohan^Aff10, Malinowski, Paweł^Aff10

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Rizzo, Piervincenzo, editor^Aff8, Milazzo, Alberto, editor^Aff9

المصدر: European Workshop on Structural Health Monitoring : EWSHM 2022 - Volume 3. 270:170-179

المؤلفون: Singh, Shishir Kumar^Aff10, Fakih, Mohammad Ali^Aff10, Malinowski, Paweł^Aff10

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Rizzo, Piervincenzo, editor^Aff8, Milazzo, Alberto, editor^Aff9

المصدر: European Workshop on Structural Health Monitoring : EWSHM 2022 - Volume 1. 253:874-882

المؤلفون: Fakih, Mohammad Ali, Singh, Shishir Kumar, Mustapha, Samir, Radzienski, Maciej, Malinowski, Paweł H.

المصدر: In Mechanical Systems and Signal Processing 1 November 2023 202