يعرض 1 - 6 نتائج من 6 نتيجة بحث عن '"Manna, Antonio La"', وقت الاستعلام: 1.01s تنقيح النتائج
  1. 1
    مؤتمر
    Thermo mechanical challenges for processing and packaging stacked ultrathin wafers

    المؤلفون: Gonzalez, Mario, Vandevelde, Bart, Manna, Antonio La, Swinnen, Bart, Beyne, Eric

    المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :7-12 May, 2013

    Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

    المؤلفون: Civale, Yann, Van Huylenbroeck, Stefaan, Redolfi, Augusto, Guo, Wei, Gavan, Khashayar Babaei, Jaenen, Patrick, Manna, Antonio La, Beyer, Gerald, Swinnen, Bart, Beyne, Eric

    المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1420-1424 May, 2013

    Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    In-tier diagnosis of power domains in 3D TSV ICs

    المؤلفون: Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Kim, Jaemin, Minas, Nikolaos, Marchal, Pol, Travaly, Youssef, Libois, Michael, Manna, Antonio La, Zhang, Wenqi, Beyne, Eric

    المصدر: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-6 Jan, 2012

    Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

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  4. 4
    مؤتمر
    In-tier diagnosis of power domains in 3D TSV ICs.

    المؤلفون: Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Kim, Jaemin, Minas, Nikolaos, Marchal, Pol, Travaly, Youssef, Libois, Michael, Manna, Antonio La, Zhang, Wenqi, Beyne, Eric

    المصدر: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International; 1/ 1/2011, p1-6, 6p

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  5. 5
    دورية أكاديمية
    Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits.

    المؤلفون: Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, Manna, Antonio La, Zhang, Wenqi, Beyer, Gerald, Beyne, Eric

    المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Jun2014, Vol. 4 Issue 6, p1026-1037, 12p

    مصطلحات موضوعية: SUBSTRATE noise, THROUGH-silicon via, INTEGRATED circuits, SILICON, ELECTRIC capacity

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  6. 6
    دورية
    Fine Pitch Micro-Bump Interconnections for Advanced 3D Chip Stacking

    المؤلفون: Zhang, Wenqi, Limaye, Paresh, Manna, Antonio La, Beyne, Eric, Soussan, Philippe

    المصدر: ECS Transactions; March 2011, Vol. 34 Issue: 1 p523-528, 6p

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