يعرض 1 - 10 نتائج من 1,502 نتيجة بحث عن '"Manson"', وقت الاستعلام: 2.14s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :234-239 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

  2. 2
    مؤتمر

    المصدر: 2022 International Conference on Mechanical Engineering and Power Engineering (MEPE) Mechanical Engineering and Power Engineering (MEPE), 2022 International Conference on. :22-27 Dec, 2022

    Relation: 2022 International Conference on Mechanical Engineering and Power Engineering (MEPE)

  3. 3
    كتاب إلكتروني

    المؤلفون: Mey, SometreyAff13, Kishiki, ShoichiAff14, Hasegawa, TakashiAff15

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Cui, Zhen-Dong, Series EditorAff8, Mazzolani, Federico M., editorAff9, Piluso, Vincenzo, editorAff10, Nastri, Elide, editorAff11, Formisano, Antonio, editorAff12

    المصدر: Proceedings of the 11th International Conference on Behaviour of Steel Structures in Seismic Areas : STESSA 2024 - Volume 1. 519:496-508

  4. 4
    كتاب إلكتروني

    المؤلفون: Jiao, YuAff13, Yamada, SatoshiAff14

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Cui, Zhen-Dong, Series EditorAff8, Mazzolani, Federico M., editorAff9, Piluso, Vincenzo, editorAff10, Nastri, Elide, editorAff11, Formisano, Antonio, editorAff12

    المصدر: Proceedings of the 11th International Conference on Behaviour of Steel Structures in Seismic Areas : STESSA 2024 - Volume 1. 519:470-483

  5. 5
    كتاب إلكتروني

    المؤلفون: Yu, SongsongAff38, Hou, ZhongweiAff39, Liu, QuanAff39, Liu, JiangAff38, Cao, YuAff38

    المساهمون: Angrisani, Leopoldo, Series EditorAff1, Arteaga, Marco, Series EditorAff2, Chakraborty, Samarjit, Series EditorAff3, Chen, Jiming, Series EditorAff4, Chen, Shanben, Series EditorAff5, Chen, Tan Kay, Series EditorAff6, Dillmann, Rüdiger, Series EditorAff7, Duan, Haibin, Series EditorAff8, Ferrari, Gianluigi, Series EditorAff9, Ferre, Manuel, Series EditorAff10, Jabbari, Faryar, Series EditorAff11, Jia, Limin, Series EditorAff12, Kacprzyk, Janusz, Series EditorAff13, Khamis, Alaa, Series EditorAff14, Kroeger, Torsten, Series EditorAff15, Li, Yong, Series EditorAff16, Liang, Qilian, Series EditorAff17, Martín, Ferran, Series EditorAff18, Ming, Tan Cher, Series EditorAff19, Minker, Wolfgang, Series EditorAff20, Misra, Pradeep, Series EditorAff21, Mukhopadhyay, Subhas, Series EditorAff22, Ning, Cun-Zheng, Series EditorAff23, Nishida, Toyoaki, Series EditorAff24, Oneto, Luca, Series EditorAff25, Panigrahi, Bijaya Ketan, Series EditorAff26, Pascucci, Federica, Series EditorAff27, Qin, Yong, Series EditorAff28, Seng, Gan Woon, Series EditorAff29, Speidel, Joachim, Series EditorAff30, Veiga, Germano, Series EditorAff31, Wu, Haitao, Series EditorAff32, Zamboni, Walter, Series EditorAff33, Tan, Kay Chen, Series EditorAff34, Yang, Qingxin, editorAff35, Li, Zewen, editorAff36, Luo, An, editorAff37

    المصدر: The proceedings of the 18th Annual Conference of China Electrotechnical Society : Volume VII. 1169:207-216

  6. 6
  7. 7
    مؤتمر

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

  8. 8
  9. 9
    دورية أكاديمية

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 42(7):1089-1092 Jul, 2021

  10. 10
    مؤتمر

    المؤلفون: Galbiati, Enrico

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-7 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)